ELECTRONIC MODULE WITH THREE-DIMENSIONAL COMMUNICATION INTERFACE
    2.
    发明申请
    ELECTRONIC MODULE WITH THREE-DIMENSIONAL COMMUNICATION INTERFACE 有权
    具有三维通信接口的电子模块

    公开(公告)号:US20150269473A1

    公开(公告)日:2015-09-24

    申请号:US14441088

    申请日:2013-11-25

    Applicant: GEMALTO SA

    CPC classification number: G06K19/07754 G06K19/07728 G06K19/07775 H01L31/18

    Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

    Abstract translation: 本发明涉及一种制造具有连接到天线的集成电路芯片的电子模块的方法。 该方法包括以下步骤:制造具有电互连区域的模块,连接到互连区域的芯片和至少覆盖芯片和互连区域的一部分的保护元件,以及连接到芯片并布置在芯片上方的无线电天线 。 该方法包括以三维直接在保护元件上产生天线整体或部分的一部分或其轨道,用于将其连接到互连区域。

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