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    Encapsulating composition for electronic circuit boards and process for applying same
    2.
    发明授权
    Encapsulating composition for electronic circuit boards and process for applying same 失效
    电子电路板的封装组合物及其应用方法

    公开(公告)号：US3652333A

    公开(公告)日：1972-03-28

    申请号：US3652333D

    申请日：1970-02-02

    Applicant: GEN DYNAMICS CORP

    Inventor： WARREN JOHN M

    IPC: C09D175/06 ,  H01B3/30 ,  H01B3/44 ,  H05K3/28 ,  H05K3/34 ,  B44D1/42

    CPC classification number: H05K3/284 ,  C09D175/06 ,  H01B3/302 ,  H01B3/447 ,  H05K3/3447 ,  H05K2201/09872 ,  H05K2201/10977 ,  H05K2203/1322 ,  Y10S428/901 ,  Y10T428/31576 ,  Y10T428/31909 ,  C08L2666/34

    Abstract: A process for applying a polyurethane gel composition for coating and encapsulating the electronic circuitry on a circuit board wherein the said composition consists essentially of an admixture of an elastomeric linear polyesterurethane of high molecular weight; a tetrahydrofuran intermediate monomer solvent and ethylene glycol monoethylether acetate, which composition is preferably sprayed over the object circuitry and onto the related electronic circuit board or other substrate as a vaporized gel of minute viscous globules which simultaneously forms a substantially uniform protective film over the substrate and encapsulates the circuit''s conduit and conduit terminals as well as other protrusions, including elements having sharp points, knife edges and the like. This prime coat is then dried and may be subsequently followed by one or more dip coatings which are formed by immersion of the dried workpiece into a mixture of polymethyl methacrylate with a copolymer of ethyl acrylate/methyl methylacrylate.

    Abstract translation: 一种用于将电子电路涂覆和封装在电路板上的聚氨酯凝胶组合物的方法，其中所述组合物基本上由高分子量的弹性线性聚酯聚氨酯的混合物组成; 四氢呋喃中间体单体溶剂和乙二醇单乙醚乙酸酯，该组合物优选在物体电路上喷射到相关电子电路板或其它基底上，作为微小粘性球的蒸发凝胶，其同时在基底上形成基本均匀的保护膜， 封装电路的管道和导管端子以及其他突起，包括具有尖锐点，刀刃等的元件。 然后将该底涂层干燥，随后可以通过将干燥的工件浸入聚甲基丙烯酸甲酯与丙烯酸乙酯/甲基丙烯酸甲酯的共聚物的混合物中而形成的一个或多个浸渍涂层。

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