公开(公告)号：DE60115467D1

公开(公告)日：2006-01-05

申请号：DE60115467

申请日：2001-08-21

Applicant: GEN ELECTRIC

Inventor： BRAAT J ,  DAVID BENNY ,  GUO HUA ,  LISKA JURAJ ,  CHAO SHIN-I ,  ZARNOCH PAUL

IPC: C08K3/04 ,  C08K3/06 ,  C08L9/06 ,  C08L71/10 ,  C08L71/12

Abstract: An elastomer-thermoplastic composition comprising styrene butadiene random copolymer and poly(arylene ether) resin and methods of making the composition are disclosed.

公开(公告)号：DE60107759T2

公开(公告)日：2005-12-01

申请号：DE60107759

申请日：2001-01-18

Applicant: GEN ELECTRIC

Inventor： ZARNOCH PAUL ,  GUO HUA ,  CHAO SHIN-I

IPC: C08F283/01 ,  C08G63/54 ,  C08G65/48 ,  C08K5/06 ,  C08L67/06 ,  C08L71/12 ,  C08G65/38

Abstract: A curable resin composition includes an unsaturated polyester, an alkenyl aromatic compound, and a capped poly(arylene ether). The composition is suitable for low temperature curing and exhibits reduced curing shrinkage and reduced brittleness.

公开(公告)号：DE60107759D1

公开(公告)日：2005-01-20

申请号：DE60107759

申请日：2001-01-18

Applicant: GEN ELECTRIC

Inventor： ZARNOCH PAUL ,  GUO HUA ,  CHAO SHIN-I

IPC: C08F283/01 ,  C08G63/54 ,  C08G65/48 ,  C08K5/06 ,  C08L67/06 ,  C08L71/12 ,  C08G65/38

Abstract: A curable resin composition includes an unsaturated polyester, an alkenyl aromatic compound, and a capped poly(arylene ether). The composition is suitable for low temperature curing and exhibits reduced curing shrinkage and reduced brittleness.

公开(公告)号：DE60115467T2

公开(公告)日：2006-08-03

申请号：DE60115467

申请日：2001-08-21

Applicant: GEN ELECTRIC

Inventor： BRAAT J ,  DAVID BENNY ,  GUO HUA ,  LISKA JURAJ ,  CHAO SHIN-I ,  ZARNOCH PAUL

IPC: C08L9/06 ,  C08K3/04 ,  C08K3/06 ,  C08L71/10 ,  C08L71/12

Abstract: An elastomer-thermoplastic composition comprising styrene butadiene random copolymer and poly(arylene ether) resin and methods of making the composition are disclosed.