公开(公告)号：DE3885054T2

公开(公告)日：1994-05-11

申请号：DE3885054

申请日：1988-08-24

Applicant: GEN ELECTRIC CO N D GES D STAA

Inventor： FOUST DONALD FRANKLIN ,  DUMAS WILLIAM VINCENT ,  LAMBY EDWARD JOHN ,  KARAS BRADLEY ROSS

IPC: C23C18/40 ,  C08J7/12 ,  C09J5/02 ,  C23C18/20 ,  C23C18/26 ,  H05K3/38 ,  C23C18/18

Abstract: A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.