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1.发明申请ELECTRODEPOSITION MEDIUMS FOR FORMATION OF PROTECTIVE COATINGS ELECTROCHEMICALLY DEPOSITED ON METAL SUBSTRATES 审中-公开用于形成金属基板电化学保护涂层的电沉积介质公开(公告)号：US20160083862A1
公开(公告)日：2016-03-24
申请号：US14863104
申请日：2015-09-23
Applicant: GENERAL CABLE TECHNOLOGIES CORPORATION
Inventor： Vinod Chintamani Malshe , Sameer Shankar Jadhav , Vitthal Abaso Sawant , Sathish Kumar Ranganathan , Cody R. Davis , Srinivas Siripurapu , Vijay Mhetar , Ryan M. Andersen
IPC: C25D9/06
CPC classification number: C25D9/06 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/06 , C25D11/30 , C25D11/34 , H01B1/023 , H01B13/0033
Abstract: Articles including a conductive metal substrate and a protective coating on the metal substrate are provided. The protective coating is electrochemically deposited from an electrodeposition medium including a silicon alkoxide and quaternary ammonium compounds or quaternary phosphonium compounds. Methods of electrochemically depositing such protective coatings are also described herein.
Abstract translation: 提供了包括金属基底上的导电金属基底和保护涂层的物品。 保护涂层由包括硅烷醇盐和季铵化合物或季鏻化合物的电沉积介质进行电化学沉积。 电化学沉积这种保护涂层的方法也在本文中描述。
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公开(公告)号：US10246791B2
公开(公告)日：2019-04-02
申请号：US14863104
申请日：2015-09-23
Applicant: GENERAL CABLE TECHNOLOGIES CORPORATION
Inventor： Vinod Chintamani Malshe , Sameer Shankar Jadhav , Vitthal Abaso Sawant , Sathish Kumar Ranganathan , Cody R. Davis , Srinivas Siripurapu , Vijay Mhetar , Ryan M. Andersen
Abstract: Articles including a conductive metal substrate and a protective coating on the metal substrate are provided. The protective coating is electrochemically deposited from an electrodeposition medium including a silicon alkoxide and quaternary ammonium compounds or quaternary phosphonium compounds. Methods of electrochemically depositing such protective coatings are also described herein.
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