Abstract:
A method for modifying a composite component may include positioning a barrier segment between an infiltrated segment of the composite component and a green segment to form an assembly; and initiating an infiltration process. The barrier segment may have a barrier segment permeability that is lower than a permeability of the infiltrated segment, a permeability of the green segment, or both. A composite component may include an infiltrated segment infiltrated with a molten material during a prior infiltration process; a green segment that is uninfiltrated; and a barrier segment having a microstructure different from the infiltrated segment, the green segment, or both. The microstructure of the barrier segment may be configured to slow a flow of material between the infiltrated segment and the green segment during a subsequent infiltration process.
Abstract:
A device including an LED light source optically coupled to a phosphor material including a green-emitting phosphor selected from the group consisting of compositions (A1)-(A62) and combinations thereof.
Abstract:
A lighting apparatus is presented. The lighting apparatus includes a semiconductor light source, a color stable Mn4+ doped phosphor and a quantum dot material, each of the color stable Mn4+ doped phosphor and the quantum dot material being radiationally coupled to the semiconductor light source. A percentage intensity loss of the color stable Mn4+ doped phosphor after exposure to a light flux of at least 20 w/cm2 at a temperature of at least 50 degrees Celsius for at least 21 hours is ≤4%. A backlight device including the lighting apparatus is also presented.
Abstract:
Methods for fabricating coated semiconductor elements are presented. The methods include the steps of combining a phosphor of formula I and a polymer binder to form a composite material, providing a semiconductor wafer including IniGajAlkN, wherein 0≤i; 0≤j; 0≤k, and a sum of i, j and k is equal to 1, coating the composite material on a surface of the semiconductor wafer to form a coated semiconductor wafer, and dicing the coated semiconductor wafer using a cutting fluid apparatus to form one or more coated semiconductor elements. A cutting fluid of the cutting fluid apparatus includes a C1-C20 alcohol, a C1-C20 ketone, a C1-C20 acetate compound, acetic acid, oleic acid, carboxylic acid, a source of A, silicic acid, or a combination thereof.
Abstract:
A phosphor material is presented that includes a blend of a first phosphor, a second phosphor and a third phosphor. The first phosphor includes a composition having a general formula of RE2−yM1+yA2−yScySin−wGewO12+δ:Ce3+ wherein RE is selected from a lanthanide ion or Y3+, where M is selected from Mg, Ca, Sr or Ba, A is selected from Mg or Zn and where 0≦y≦2, 2.5≦n≦3.5, 0≦w≦1, and −1.5≦δ≦1.5. The second phosphor includes a complex fluoride doped with manganese (Mn4+), and the third phosphor include a phosphor composition having an emission peak in a range from about 520 nanometers to about 680 nanometers. A lighting apparatus including such a phosphor material is also presented. The light apparatus includes a light source in addition to the phosphor material.
Abstract:
A color stable Mn4+ doped phosphor of formula I, Ax[MFy]:Mn4+ I wherein A is Li, Na, K, Rb, Cs, or a combination thereof; M is Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or a combination thereof; x is the absolute value of the charge of the [MFy] ion; y is 5, 6 or 7; and wherein % intensity loss of the phosphor after exposure to light flux of at least 80 w/cm2 at a temperature of at least 50° C. for at least 21 hours is ≦4%.
Abstract:
A method of monitoring a surface temperature of a hot gas path component includes directing an excitation beam having an excitation wavelength at a layer of a sensor material composition deposited on a hot gas path component to induce a fluorescent radiation. The method includes measuring fluorescent radiation emitted by the sensor material composition. The fluorescent radiation includes at least a first intensity at a first wavelength and a second intensity at a second wavelength. The surface temperature of the hot gas path component is determined based on a ratio of the first intensity at the first wavelength and the second intensity at the second wavelength of the fluorescent radiation emitted by the sensor material composition.
Abstract:
A process for synthesizing a manganese (Mn4+) doped phosphor includes milling particles of the a phosphor precursor of formula I, and contacting the milled particles with a fluorine-containing oxidizing agent at an elevated temperature Ax[MFy]:Mn4+ (I) wherein A is Li, Na, K, Rb, Cs, or a combination thereof; M is Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or a combination thereof; x is the absolute value of the charge of the [MFy] ion; y is 5, 6 or 7.
Abstract:
An aerospace vehicle including: a body, wherein the body is configured to generate heat during operation; a coating disposed over at least a portion of the body, the coating being configured to shift a frequency of at least one wavelength of the heat generated by the body from a first frequency to a second frequency having higher transmissivity relative to a neighboring medium surrounding the body as compared to the first frequency.
Abstract:
A method of monitoring a surface temperature of a hot gas path component includes directing an excitation beam having an excitation wavelength at a layer of a sensor material composition deposited on a hot gas path component to induce a fluorescent radiation. The method includes measuring fluorescent radiation emitted by the sensor material composition. The fluorescent radiation includes at least a first intensity at a first wavelength and a second intensity at a second wavelength. The surface temperature of the hot gas path component is determined based on a ratio of the first intensity at the first wavelength and the second intensity at the second wavelength of the fluorescent radiation emitted by the sensor material composition.