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公开(公告)号：US12298274B2
公开(公告)日：2025-05-13
申请号：US18077463
申请日：2022-12-08
Applicant: GENERAL ELECTRIC COMPANY
IPC: G01N27/90
Abstract: A sensor for a flexible sensor assembly includes a drive coil, a first set of sensing coils, a second set of sensing coils, and a configuration for sensing for discontinuities in a structure desired to be sensed. A method of operating the sensor can include positioning the sensor proximate to the structure, energizing the drive coil, and sensing eddy currents with the sensing coils.
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公开(公告)号：US20210041627A1
公开(公告)日：2021-02-11
申请号：US16536029
申请日：2019-08-08
Applicant: General Electric Company
Inventor： Joleyn Eileen Brewer , James Wilson Rose
IPC: G02B6/13
Abstract: This disclosure generally relates to systems and methods for improving adhesive bonding between a layer of a device that transmits optical signals, such as a photonics integrated circuit, and a waveguide that helps to transmit at least some of the optical signals. Adhesion methods may include using vapor-phase encapsulation, capillary underfill, or compressive displacement to secure the waveguide to at least one layer of the device that transmits optical signals. In each of these methods, the adhesion method may create an adhesive interface between at least a portion of the waveguide and a contacting layer of the device that transmits optical signals.
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公开(公告)号：US09960124B2
公开(公告)日：2018-05-01
申请号：US14061531
申请日：2013-10-23
Applicant: General Electric Company
IPC: H01L23/552
CPC classification number: H01L23/552 , H01L2924/0002 , H01L2924/00
Abstract: In certain embodiments, a mixed signal integrated circuit is provided that includes both a digital portion and an analog portion. A shield is provided that overlays one of the digital portion or the analog portion of the mixed signal integrated circuit. The shield limits propagation of signals between the digital portion and the analog portion of the mixed signal integrated circuit.
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公开(公告)号：US20240077453A1
公开(公告)日：2024-03-07
申请号：US18077463
申请日：2022-12-08
Applicant: GENERAL ELECTRIC COMPANY
IPC: G01N27/90
CPC classification number: G01N27/9006
Abstract: A sensor for a flexible sensor assembly includes a drive coil, a first set of sensing coils, a second set of sensing coils, and a configuration for sensing for discontinuities in a structure desired to be sensed. A method of operating the sensor can include positioning the sensor proximate to the structure, energizing the drive coil, and sensing eddy currents with the sensing coils.
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5.发明授权公开(公告)号：US10163773B1
公开(公告)日：2018-12-25
申请号：US15675144
申请日：2017-08-11
Applicant: General Electric Company
Inventor： Christopher James Kapusta , Kaustubh Ravindra Nagarkar , Arun Virupaksha Gowda , James Wilson Rose
IPC: H01L23/48 , H01L23/498 , H01L23/00 , H01L21/48
Abstract: An electronics package includes an interconnect assembly comprising a first insulating substrate, a first wiring layer formed on a lower surface of the first insulating substrate, and at least one through hole extending through the first insulating substrate and the first wiring layer. The electronics package also includes an electrical component assembly comprising an electrical component having an active surface coupled to an upper surface of the first insulating substrate opposite the lower surface. The active surface of the electrical comprises at least one metallic contact pad. At least one conductive stud is coupled to the at least one metallic contact pad and is positioned within the at least one through hole. A conductive plug contacts the first wiring layer and extends into the at least one through hole to at least partially surround the at least one conductive stud.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20170031038A1
公开(公告)日：2017-02-02
申请号：US14815107
申请日：2015-07-31
Applicant: General Electric Company
Inventor： James Wilson Rose , David Leo McDaniel , Jianjun Guo , Sergei Ivanovich Dolinsky , Adrian Ivan
IPC: G01T1/20 , H01L27/146 , G01T1/29
CPC classification number: G01T1/2018 , G01T1/208 , G01T1/2985 , H01L27/14663 , H01L27/14685
Abstract: A photon detector having an optical transparent plate and photodiode array interconnected by an optical light guide array. The optical light guide array including elements providing a transmission line between the optical transparent plate and the photodiode array, where the position of one or more optical light guide elements is formed to adjust for a miss-registered photodiode individual element. A method for assembling the photon detector includes depositing a non-wetting film on opposing surfaces of the optical transparent plate and/or photodiode array, altering the deposited non-wetting film in regions of individual photodiode elements, dispensing an optical coupler adhesive on the optical transparent plate and photodiode array to form adhesive beads, aligning the opposing surfaces, assembling the opposing surfaces so that the corresponding optical coupler adhesive beads contact each other, and curing the optical coupler adhesive to form a structurally merged photon detector having optical light guide elements.
Abstract translation: 一种光子检测器，具有通过光学导光阵列互连的光学透明板和光电二极管阵列。 所述光导引阵列包括在所述光学透明板和所述光电二极管阵列之间提供传输线的元件，其中形成一个或多个光导元件的位置以调整未注册的光电二极管单独元件。 用于组装光子检测器的方法包括在光学透明板和/或光电二极管阵列的相对表面上沉积非润湿膜，改变在各个光电二极管元件的区域中沉积的非润湿膜，在光学器件上分配光学耦合器粘合剂 透明板和光电二极管阵列以形成粘合剂珠，对准相对表面，组装相对表面，使得相应的光耦合器粘合剂珠彼此接触，并固化光耦合器粘合剂以形成具有光学导光元件的结构上合并的光子检测器。
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公开(公告)号：US20160183365A1
公开(公告)日：2016-06-23
申请号：US14574050
申请日：2014-12-17
Applicant: GENERAL ELECTRIC COMPANY
Inventor： James Wilson Rose , Donna Marie Sherman , Jeffrey Scott Erlbaum
Abstract: The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible circuit may be affixed. In certain embodiments, the reconfigurable substrate may be moved between different configurations, certain of which are suitable for fabrication and certain of which are suitable for operation.
Abstract translation: 本公开涉及电气部件的制造，特别是涉及可以将柔性电路固定到其上的可重新配置的基板的使用。 在某些实施例中，可重新配置的衬底可以在不同配置之间移动，其中某些构造适合于制造，并且其中某些适合于操作。
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公开(公告)号：US09753151B2
公开(公告)日：2017-09-05
申请号：US14815107
申请日：2015-07-31
Applicant: General Electric Company
Inventor： James Wilson Rose , David Leo McDaniel , Jianjun Guo , Sergei Ivanovich Dolinsky , Adrian Ivan
IPC: G01T1/20 , G01T1/208 , G01T1/29 , H01L27/146
CPC classification number: G01T1/2018 , G01T1/208 , G01T1/2985 , H01L27/14663 , H01L27/14685
Abstract: A photon detector having an optical transparent plate and photodiode array interconnected by an optical light guide array. The optical light guide array including elements providing a transmission line between the optical transparent plate and the photodiode array, where the position of one or more optical light guide elements is formed to adjust for a miss-registered photodiode individual element. A method for assembling the photon detector includes depositing a non-wetting film on opposing surfaces of the optical transparent plate and/or photodiode array, altering the deposited non-wetting film in regions of individual photodiode elements, dispensing an optical coupler adhesive on the optical transparent plate and photodiode array to form adhesive beads, aligning the opposing surfaces, assembling the opposing surfaces so that the corresponding optical coupler adhesive beads contact each other, and curing the optical coupler adhesive to form a structurally merged photon detector having optical light guide elements.
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公开(公告)号：US09689996B2
公开(公告)日：2017-06-27
申请号：US13857624
申请日：2013-04-05
Applicant: General Electric Company
Inventor： Naresh Kesavan Rao , James Wilson Rose , Christopher David Unger , Abdelaziz Ikhlef , Jonathan David Short
IPC: A61B6/00 , G01T1/24 , H01L27/146
CPC classification number: G01T1/247 , A61B6/42 , A61B6/4233 , H01L27/14661 , H01L27/14663
Abstract: Improved imaging systems are disclosed. More particularly, the present disclosure provides for an improved image sensor assembly for an imaging system, the image sensor assembly having an integrated photodetector array and its associated data acquisition electronics fabricated on the same substrate. By integrating the electronics on the same substrate as the photodetector array, this thereby reduces fabrications costs, and reduces interconnect complexity. Since both the photodiode contacts and the associated electronics are on the same substrate/plane, this thereby substantially eliminates certain expensive/time-consuming processing techniques. Moreover, the co-location of the electronics next to or proximal to the photodetector array provides for a much finer resolution detector assembly since the interconnect bottleneck between the electronics and the photodetector array is substantially eliminated/reduced. The co-location of the electronics next to or proximal to the photodetector array also enables/facilitates programmable pixel configuration for optimal image quality.
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10.发明申请公开(公告)号：US20190148279A1
公开(公告)日：2019-05-16
申请号：US16229049
申请日：2018-12-21
Applicant: General Electric Company
Inventor： Christopher James Kapusta , Kaustubh Ravindra Nagarkar , Arun Virupaksha Gowda , James Wilson Rose
IPC: H01L23/498 , H01L23/00 , H01L21/48
Abstract: An electronics package includes an interconnect assembly comprising a first insulating substrate, a first wiring layer formed on a lower surface of the first insulating substrate, and at least one through hole extending through the first insulating substrate and the first wiring layer. The electronics package also includes an electrical component assembly comprising an electrical component having an active surface coupled to an upper surface of the first insulating substrate opposite the lower surface. The active surface of the electrical comprises at least one metallic contact pad. At least one conductive stud is coupled to the at least one metallic contact pad and is positioned within the at least one through hole. A conductive plug contacts the first wiring layer and extends into the at least one through hole to at least partially surround the at least one conductive stud.
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