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公开(公告)号:US11733685B2
公开(公告)日:2023-08-22
申请号:US17038386
申请日:2020-09-30
Inventor: Sun Kyu Lee , Dae Gweon Koh , Han Ul Kim , Jin Hyuk Hong , Dinuka Ravimal Ranawaka Arachchige
IPC: G05B19/418 , G01N21/88 , G06T7/00
CPC classification number: G05B19/41875 , G01N21/8806 , G06T7/0008 , G06T2207/10052
Abstract: The present disclosure relates to a surface inspection method using a mold surface inspection device, and more specifically, to a surface inspection method using a mold surface inspection device including a setting part in which an inspection object is set, a light source part configured to irradiate the inspection object with irradiated light so that a reflective highlight is generated on a surface of the inspection object, an imaging part configured to image the surface of the inspection object so that a highlight region where a reflective highlight is generated is included, and an image processing part configured to process an image imaged in the imaging part to provide the image to a worker so that the worker determines whether defects are generated on the surface of the inspection object on the basis of the image.