EVALUATING APPARATUS FOR THERMAL BOUNDARY CONDUCTANCE USING ACOUSTIC PHONON WAVES

    公开(公告)号:US20240159658A1

    公开(公告)日:2024-05-16

    申请号:US18451672

    申请日:2023-08-17

    Abstract: The present disclosure relates to an apparatus for evaluating thermal conductance of an interface on the basis of how much the phases of acoustic phonons, which are produced in a semiconductor, change on a semiconductor interface. The apparatus for evaluating thermal conductance of a semiconductor interface according to an embodiment of the present disclosure includes: a spectrometer exciting acoustic phonons in a semiconductor by irradiating a laser beam to the semiconductor; and a processor evaluating thermal conductance of an interface of the semiconductor in accordance with a phase difference of a ascending acoustic phonon propagating toward the interface and reflecting from the interface and a descending acoustic phonon propagating in an opposite direction to the interface.

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