Abstract:
Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.
Abstract:
Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.
Abstract:
Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling of an assembled wafer handling machine with a robotic arm capable of picking up and moving wafers comprises: a sensor capable of being secured to the assembled wafer handling machine and a controller in electronic communication with the sensor and including control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold. Herein, the system is modular in nature and the controller is independent of an automation control module used to control movement of the robotic arm.