公开(公告)号：US20210005454A1

公开(公告)日：2021-01-07

申请号：US17023853

申请日：2020-09-17

Applicant: GLOBALFOUNDRIES INC.

Inventor： Hsueh-Chung CHEN ,  Ravi P. SRIVASTAVA ,  Somnath GHOSH ,  Nicholas V. LICAUSI ,  Terry A. SPOONER ,  Sean REIDY

IPC: H01L21/033

Abstract: The present disclosure relates to a structure which includes a first metal layer patterned as a mandrel, a dielectric spacer on the first metal layer, and a second metal layer on the dielectric spacer.

公开(公告)号：US20200083043A1

公开(公告)日：2020-03-12

申请号：US16125066

申请日：2018-09-07

Applicant: GLOBALFOUNDRIES INC.

Inventor： Hsueh-Chung CHEN ,  Ravi P. SRIVASTAVA ,  Somnath GHOSH ,  Nicholas V. LICAUSI ,  Terry A. SPOONER ,  Sean REIDY

IPC: H01L21/033

Abstract: The present disclosure relates to a structure which includes a first metal layer patterned as a mandrel, a dielectric spacer on the first metal layer, and a second metal layer on the dielectric spacer.