公开(公告)号：US09401312B1

公开(公告)日：2016-07-26

申请号：US14736769

申请日：2015-06-11

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Sukeshwar Kannan ,  Kaushal Kannan

IPC: H01L21/768 ,  H03K19/177 ,  H03K19/173 ,  H01L21/66

CPC classification number: H03K19/17764 ,  G01R31/2853 ,  H01L22/14 ,  H03K19/1735 ,  H03K19/17736

Abstract: A method of redirecting signal bits associated with or corresponding to defective TSVs of a TSV array to a row or a column of redundant TSVs in the TSV array using a 2:4 Decoder and 4:2 Encoder and the resulting device are provided. Embodiments include forming a TSV array between a bottom die and a top die of a 3D IC stack, the TSV array having a row and a column of redundant TSVs; identifying a defective TSV of the TSV array; determining whether to shift a signal bit associated with or corresponding to the defective TSV in a first and/or a second direction towards the row or the column of redundant TSVs; and shifting the signal bit in the first and/or the second direction until the signal bit has been redirected to the row or the column of redundant TSVs.

Abstract translation: 提供了使用2：4解码器和4：2编码器将与TSV阵列的有缺陷TSV相关联或对应的信号位重定向到TSV阵列中的冗余TSV的行或列的方法，并且得到所述装置。 实施例包括在3D IC堆叠的底模和顶模之间形成TSV阵列，该TSV阵列具有一列和一列冗余TSV; 识别TSV阵列的有缺陷的TSV; 确定是否将与第一和/或第二方向上的有缺陷TSV相关联的信号位或对应于与残余TSV相对应的信号位朝着冗余TSV的行或列移位; 并且在第一和/或第二方向上移位信号位，直到信号位被重定向到冗余TSV的行或列。