公开(公告)号：US08765512B2

公开(公告)日：2014-07-01

申请号：US13706488

申请日：2012-12-06

Applicant: Georgia Tech Research Corporation

Inventor： Paul A Kohl ,  Rajarshi Saha ,  Nathan Fritz

IPC: H01L29/84 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00261 ,  B81B3/0018 ,  B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0154

Abstract: This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20 μm×400 μm to 300 μm×400 μm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality.

Abstract translation: 本发明公开并要求用于微机电装置（MEMS）的成本有效的晶片级封装工艺。 具体来说，MEMS器件的可移动部件以晶片形式被封装和保护，从而可以使用商品的引线框架封装。 已经使用外涂聚合物，例如环氧环己基多面体低聚倍半硅氧烷（EPOSS）作为掩模材料来模制牺牲聚合物以及覆盖空气腔。 所产生的空气腔是干净，无碎片和坚固的。 空腔具有相当大的强度以承受MEMS器件的引线框架封装期间的成型压力。 已经制造了从20μm×400μm到300μm×400μm的宽范围的空腔，并且被证明是机械稳定的。 这些可能会在各种尺寸范围内容纳MEMS器件。 已经使用纳米压痕研究了腔的强度，并使用分析和有限元技术进行了建模。 使用该协议封装的电容谐振器已经显示出清洁的感测电极和良好的功能。

公开(公告)号：US20130341736A1

公开(公告)日：2013-12-26

申请号：US13706488

申请日：2012-12-06

Applicant: Georgia Tech Research Corporation

Inventor： Paul A. Kohl ,  Rajarshi Saha ,  Nathan Fritz

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00261 ,  B81B3/0018 ,  B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0154

Abstract: This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20 μm×400 μm to 300 μm×400 μm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality.

Abstract translation: 本发明公开并要求用于微机电装置（MEMS）的成本有效的晶片级封装工艺。 具体来说，MEMS器件的可移动部件以晶片形式被封装和保护，从而可以使用商品的引线框架封装。 已经使用外涂聚合物，例如环氧环己基多面体低聚倍半硅氧烷（EPOSS）作为掩模材料来模制牺牲聚合物以及覆盖空气腔。 所产生的空气腔是干净，无碎片和坚固的。 空腔具有相当大的强度以承受MEMS器件的引线框架封装期间的成型压力。 已经制造了从20mum×400mum到300mum×400mum的宽范围的空腔，显示出机械稳定。 这些可能会在各种尺寸范围内容纳MEMS器件。 已经使用纳米压痕研究了腔的强度，并使用分析和有限元技术进行了建模。 使用该协议封装的电容谐振器已经显示出清洁的感测电极和良好的功能。