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公开(公告)号:US20170302050A1
公开(公告)日:2017-10-19
申请号:US15350284
申请日:2016-11-14
Applicant: Gigaphoton Inc.
Inventor: Kouji KAKIZAKI , Masaki ARAKAWA , Kouji ASHIKAWA , Yasuhiro KAMBA , Akiyoshi SUZUKI , Osamu WAKABAYASHI
CPC classification number: H01S3/005 , G02B27/0955 , G02B27/123 , H01S3/0071 , H01S3/081 , H01S3/105 , H01S3/1305 , H01S3/225 , H01S3/2251 , H01S3/2253 , H01S3/2255 , H01S3/2256 , H01S3/2366
Abstract: The laser system may include first and second laser apparatuses and a beam delivery device. The first laser apparatus may be provided so as to emit a first laser beam to the beam delivery device in a first direction. The second laser apparatus may be provided so as to emit a second laser beam to the beam delivery device in a direction substantially parallel to the first direction. The beam delivery device may be configured to bundle the first and second laser beams and to emit the first and second laser beams from the beam delivery device to a beam delivery direction different from the first direction.
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公开(公告)号:US20180019141A1
公开(公告)日:2018-01-18
申请号:US15678950
申请日:2017-08-16
Applicant: Kyushu University , Gigaphoton Inc.
Inventor: Tomoyuki OHKUBO , Hiroshi IKENOUE , Kouji KAKIZAKI , Yasuhiro KAMBA , Osamu WAKABAYASHI
IPC: H01L21/67
CPC classification number: H01L21/67115 , H01L21/20 , H01L21/268 , H01L21/67276 , H01S3/0057 , H01S3/036 , H01S3/09702 , H01S3/0971 , H01S3/225 , H01S3/2383
Abstract: A laser system may serve as a light source of a laser annealing apparatus that irradiates a workpiece with a pulse laser beam. The laser system may include: a laser apparatus configured to generate the pulse laser beam; a time-domain pulse waveform changing apparatus configured to change time-domain pulse waveform of the pulse laser beam; and a controller configured to receive at least one parameter for generating the time-domain pulse waveform from the laser annealing apparatus and to control the time-domain pulse waveform changing apparatus.
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公开(公告)号:US20240391020A1
公开(公告)日:2024-11-28
申请号:US18796336
申请日:2024-08-07
Applicant: Gigaphoton Inc.
Inventor: Takashi ONOSE , Yasuhiro KAMBA , Hironori IGARASHI
IPC: B23K26/0622 , B23K26/06 , B23K26/064 , B23K26/70
Abstract: A laser device, to be used in a laser processing system for performing laser processing by irradiating a workpiece with laser light in a gas containing oxygen includes a solid-state oscillator including a solid-state laser device configured to output laser light having a pulse width in a range of 100 ps to 1 ns both inclusive and having a center wavelength within an oscillation wavelength range of an ArF excimer laser device and outside absorption lines of oxygen, an ArF excimer amplifier configured to amplify the laser light output from the solid-state oscillator, and a first optical pulse stretcher configured to output laser light that is burst-pulsed by dividing the laser light amplified by the ArF excimer amplifier into a plurality of pulses as the laser light being caused to circulate through a delay optical path thereof.
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公开(公告)号:US20170093119A1
公开(公告)日:2017-03-30
申请号:US15379192
申请日:2016-12-14
Applicant: Gigaphoton Inc.
Inventor: Akiyoshi SUZUKI , Osamu WAKABAYASHI , Masaki ARAKAWA , Koji ASHIKAWA , Yasuhiro KAMBA
IPC: H01S3/23 , H01S3/00 , G02B27/12 , B23K26/00 , H01L21/67 , H01L21/02 , H01L27/12 , H01S3/081 , G02B27/10
CPC classification number: H01S3/23 , B23K26/0006 , B23K26/032 , B23K26/0608 , B23K26/0622 , B23K26/082 , B23K26/352 , B23K26/707 , B23K2101/40 , B23K2103/50 , B23K2103/56 , G02B27/106 , G02B27/123 , G02B27/126 , H01L21/02532 , H01L21/02592 , H01L21/02686 , H01L21/67115 , H01L27/1285 , H01S3/0071 , H01S3/081 , H01S3/225 , H01S3/2383
Abstract: A laser system may include a plurality of laser apparatuses, a beam delivery device configured to bundle pulse laser beams emitted from respective laser apparatuses of the plurality of laser apparatuses to emit a bundled laser beam, and a controller configured to control operated laser apparatuses of the plurality of laser apparatuses such that, at a change in a number representing how many laser apparatuses are operated, a beam parameter of the bundled laser beam emitted from the beam delivery device approaches a beam parameter of the bundled laser beam emitted before the change.
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