公开(公告)号：US20030020585A1

公开(公告)日：2003-01-30

申请号：US09918897

申请日：2001-07-30

Applicant: GlimmerGlass Networks, Inc.

Inventor： Bryan P. Staker ,  Douglas L. Teeter JR. ,  Thomas A. DeBey ,  David T. Amm

IPC: H01F005/00

CPC classification number: H01H59/0009

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of substrate, such as low temperature co-fired ceramic, in which is embedded electrostatic actuation electrodes disposed in substantial alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout and the electrodes are oversized such that in combination with the ceramic assembly are configured to allow for placement of the vias within a tolerance of position relative to electrodes such that contact is not lost therebetween at the time of manufacturing.

Abstract translation: 阵列装置具有微加工SOI结构，例如MEMS阵列，其直接安装在一类基底上，例如低温共烧陶瓷，​​其中嵌入的静电致动电极与各个MEMS元件基本对齐，其中 静电电极被配置为实质上扇出并且电极尺寸过大，使得与陶瓷组件结合使得能够将通孔放置在相对于电极的位置公差范围内，使得在制造时不会在其间失去接触 。