公开(公告)号：EP4382976A1

公开(公告)日：2024-06-12

申请号：EP23199265.2

申请日：2023-09-25

Applicant: GlobalFoundries U.S. Inc.

Inventor： DASGUPTA, Arpan ,  ROBSON, Norman W. ,  MOY, Danny

IPC: G02B6/13

CPC classification number: G02B2006/1210720130101 ,  G02B6/13 ,  G02B2006/1214720130101

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an identification system, method of manufacture and method of use. The structure includes at least one waveguide structure and at least one damaged region positioned in a unique pattern on the at least one waveguide structure.

公开(公告)号：EP4439139A1

公开(公告)日：2024-10-02

申请号：EP23198430.3

申请日：2023-09-20

Applicant: GlobalFoundries U.S. Inc.

Inventor： DASGUPTA, Arpan ,  BIAN, Yusheng ,  SAFRAN, John M. ,  ROBSON, Norman

IPC: G02B6/122 ,  G02B6/30

CPC classification number: G02B6/30 ,  G02B6/1228 ,  G02B6/124

Abstract: Structures including multiple photonics chips and methods of fabricating a structure including multiple photonics chips. The structure comprises a first chip including a first edge and a first plurality of optical couplers disposed at the first edge, and a second chip including a second edge adjacent to the first edge of the first chip and a second plurality of optical couplers. The second plurality of optical couplers are disposed at the second edge adjacent to the first plurality of optical couplers.