PHOTONIC COMPONENTS WITH CHAMFERED SIDEWALLS

    公开(公告)号:EP4498136A2

    公开(公告)日:2025-01-29

    申请号:EP24152745.6

    申请日:2024-01-19

    Abstract: Structures for a photonics chip that include a photonic component and methods of forming such structures. The structure may comprise a photodetector on a substrate and a waveguide core. The photodetector includes a light-absorbing layer having a longitudinal axis, a first sidewall, and a second sidewall adjoined to the first sidewall at an interior angle. The first sidewall is slanted relative to the longitudinal axis, and the second sidewall is oriented transverse to the longitudinal axis. The waveguide core includes a tapered section adjacent to the first sidewall and the second sidewall of the light-absorbing layer.

    WAVEGUIDE ESCALATORS FOR A PHOTONICS CHIP
    2.
    发明公开

    公开(公告)号:EP4425228A1

    公开(公告)日:2024-09-04

    申请号:EP23192904.3

    申请日:2023-08-23

    Abstract: Structures for a waveguide escalator and methods of forming such structures. A structure comprises a first waveguide core (12), and a back-end-of-line stack (24) including a first dielectric layer (26), a second dielectric layer (28) on the first dielectric layer (26), an opening (32) in the second dielectric layer (28), a second waveguide core (42) including a section that overlaps with a section of the first waveguide core (12), and a plurality of third waveguide cores (34,36,38) disposed between the section of the first waveguide core (12) and the section of the second waveguide core (42). The plurality of third waveguide cores (34,36,38) are positioned inside the opening in the second dielectric layer, the first dielectric layer (26) comprises a first material with a first refractive index, and the second dielectric layer (28) comprises a second material with a second refractive index different from the first refractive index.

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