公开(公告)号：EP4475360A1

公开(公告)日：2024-12-11

申请号：EP23210786.2

申请日：2023-11-20

Applicant: GlobalFoundries U.S. Inc.

Inventor： POZDER, Scott ,  FISHER, Daniel W. ,  MALINOWSKI, John

IPC: H01S5/0232 ,  H01S5/02326 ,  H01S5/02385 ,  H01S5/024

Abstract: Structures including a photonics chip and a cavity-mounted laser chip, and methods of forming and using such structures. The structure comprises a photonics chip including a substrate and a cavity in the substrate. The structure further comprises a laser chip inside the cavity, and a lead frame comprising a first section attached to a portion of the laser chip and a second section attached to a portion of the photonics chip.