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公开(公告)号：DE69931059T2
公开(公告)日：2006-12-07
申请号：DE69931059
申请日：1999-06-18
Applicant: HAMAMATSU PHOTONICS KK
Inventor： SATO HIROTO , HOMME TAKUYA , TAKABAYASHI TOSHIO
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公开(公告)号：DE69913185D1
公开(公告)日：2004-01-08
申请号：DE69913185
申请日：1999-06-18
Applicant: HAMAMATSU PHOTONICS KK
Inventor： HOMME TAKUYA , TAKABAYASHI TOSHIO , SATO HIROTO
IPC: B05D7/24 , C08L67/02 , C23C16/00 , C30B25/02 , C30B29/12 , C30B29/54 , C30B33/00 , G01T1/00 , G01T1/20 , G21K4/00
Abstract: Comprising a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from said vapor deposition table; a second step of introducing said vapor deposition table having said substrate supported by said target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of said substrate, provided with said scintillator, introduced into said vapor deposition chamber.
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公开(公告)号：CA2261663C
公开(公告)日：2001-08-28
申请号：CA2261663
申请日：1998-02-12
Applicant: HAMAMATSU PHOTONICS KK
Inventor： SATO HIROTO , HOMME TAKUYA , TAKABAYASHI TOSHIO
Abstract: A radiation detection device comprising: a light receiving device array (6) formed by disposing two-dimensionally light receiving elements (2) on a substrate (1), arranging bonding pads (4) on the outer periphery of the substrate (1) and electrically connecting them to light receiving elements ( 2) of each row or column with signal lines (3) and depositing a protective passivation film (5) on the light receiving elements (2) and on the signal lines (3); a scintillator (7) of a CsI columnar crystal deposited on the lig ht receiving surface of the light receiving device array (6); and a protective film (11) formed by sandwiching an Al inorganic film (9) with Parillen organ ic films (8 and 10) and laminating it on the scintillator (7). The outer periphery of the protective film (11) is cut at such a position at which the bonding pads (4) are exposed, and is bonded closely to the passivation film (5) by a covering resin (12).
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公开(公告)号：AU4168299A
公开(公告)日：2000-01-10
申请号：AU4168299
申请日：1999-06-18
Applicant: HAMAMATSU PHOTONICS KK
Inventor： HOMME TAKUYA , TAKABAYASHI TOSHIO , SATO HIROTO
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公开(公告)号：AU4168099A
公开(公告)日：2000-01-05
申请号：AU4168099
申请日：1999-06-18
Applicant: HAMAMATSU PHOTONICS KK
Inventor： TAKABAYASHI TOSHIO , HOMME TAKUYA , SATO HIROTO
Abstract: In a radiation image sensor (2) comprising a scintillator panel (4) and an imaging device (6), the scintillator panel (4) comprises a radiation-transparent substrate (10), a deliquescent scintillator (12) formed on the substrate (10), and an elastic organic film (14) covering the scintillator (12), the scintillator panel (4) and imaging device (6) being bonded to each other with a matching oil (20) interposed therebetween, whereas side wall portions of the scintillator panel (4) and imaging device (6) are firmly attached to each other with a resin (24).
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Patent Agency Ranking
公开(公告)号：DE69926769T2
公开(公告)日：2006-06-29
申请号：DE69926769
申请日：1999-06-18
Applicant: HAMAMATSU PHOTONICS KK
Inventor： TAKABAYASHI TOSHIO , HOMME TAKUYA , SATO HIROTO
Abstract: A scintillator panel (2) comprises a radiation-transparent substrate (10), a flat resin film (12) formed on the substrate (10), a reflecting film (14) formed on the flat resin film (12), a deliquescent scintillator (16) formed on the reflecting film (14), and a transparent organic film (18) covering the scintillator (16).
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公开(公告)号：DE69926769D1
公开(公告)日：2005-09-22
申请号：DE69926769
申请日：1999-06-18
Applicant: HAMAMATSU PHOTONICS KK
Inventor： TAKABAYASHI TOSHIO , HOMME TAKUYA , SATO HIROTO
Abstract: A scintillator panel (2) comprises a radiation-transparent substrate (10), a flat resin film (12) formed on the substrate (10), a reflecting film (14) formed on the flat resin film (12), a deliquescent scintillator (16) formed on the reflecting film (14), and a transparent organic film (18) covering the scintillator (16).
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公开(公告)号：DE69817035D1
公开(公告)日：2003-09-11
申请号：DE69817035
申请日：1998-02-12
Applicant: HAMAMATSU PHOTONICS KK
Inventor： HOMME TAKUYA , TAKABAYASHI TOSHIO , SATO HIROTO
Abstract: Light-receiving devices 2 are two-dimensionally arranged on a substrate 1, bonding pads 4 electrically connected to the light-receiving devices 2 in the respective rows or columns via signal lines 3 are arranged on the outer periphery of the substrate 1, and a protective passivation film 5 is disposed on the light-receiving devices 2 and signal lines 3, thereby forming a light-receiving device array 6. A scintillator 7 made of columnar crystals of Csl is deposited on the light-receiving surface of the light-receiving device array 6, whereas a protective film 11 in which an Al inorganic film 9 is held between organic films 8, 10 made of Parylene is laminated thereon. The outer periphery of the protective film 11 is cut at a position where the bonding pads 4 are exposed, and is brought into close contact with the passivation film 5 with the aid of the coating resin 12.
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公开(公告)号：DE69803344T2
公开(公告)日：2002-08-14
申请号：DE69803344
申请日：1998-02-12
Applicant: HAMAMATSU PHOTONICS KK
Inventor： HOMME TAKUYA , TAKABAYASHI TOSHIO , SATO HIROTO
Abstract: Light-receiving devices 2 are two-dimensionally arranged on a substrate 1, bonding pads 4 electrically connected to the light-receiving devices 2 in the respective rows or columns via signal lines 3 are arranged on the outer periphery of the substrate 1, and a protective passivation film 5 is disposed on the light-receiving devices 2 and signal lines 3, thereby forming a light-receiving device array 6. On the light-receiving surface of the light-receiving device array 6, a scintillator 7 made of columnar crystals of CsI is deposited. On the other hand, a resin frame 8 formed like an elongated frame is disposed inside the bonding pads 4. Inside this frame, a protective film 12 in which an inorganic film 10 is held between organic films 9, 11 made of Parylene is laminated. The outer periphery of the protective film 12 is in close contact with the resin frame 8 with the aid of the coating resin 13.
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公开(公告)号：DE69803438T2
公开(公告)日：2002-07-11
申请号：DE69803438
申请日：1998-02-12
Applicant: HAMAMATSU PHOTONICS KK
Inventor： HOMME TAKUYA , TAKABAYASHI TOSHIO , SATO HIROTO
Abstract: Light-receiving devices 2 are two-dimensionally arranged on a substrate 1, bonding pads 4 electrically connected to the light-receiving devices 2 in the respective rows or columns via signal lines 3 are arranged on the outer periphery of the substrate 1, and a protective passivation film 5 is disposed on the light-receiving devices 2 and signal lines 3, thereby forming a light-receiving device array 6. A scintillator 7 made of columnar crystals of Csl is deposited on the light-receiving surface of the light-receiving device array 6, whereas a protective film 11 in which an Al inorganic film 9 is held between organic films 8, 10 made of Parylene is laminated thereon. The outer periphery of the protective film 11 is cut at a position where the bonding pads 4 are exposed, and is brought into close contact with the passivation film 5 with the aid of the coating resin 12.
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