Abstract:
This photodiode array 10 includes quenching resistors 7 which are connected in series to respective avalanche photodiodes APDs, a peripheral wiring WL which surrounds a region in which the plurality of avalanche photodiodes APDs are formed, and a plurality of relay wirings 8 which are electrically connected to the peripheral wiring WL, so as to respectively connect at least two places of the peripheral wiring WL. One of an anode and a cathode of each avalanche photodiode APD is electrically connected to any one of the relay wirings 8 via the quenching resistor 7, and the other of the anode and the cathode of each avalanche photodiode APD is electrically connected to another electrode 6 provided on a semiconductor substrate.
Abstract:
Each semiconductor chip of a detector comprises a semiconductor substrate having a plurality of photodetector units, an insulating layer formed on a front face of the semiconductor substrate, a common electrode arranged on the insulating layer, a readout line for electrically connecting a quenching resistance of each photodetector unit and the common electrode to each other, and a through electrode extending from the common electrode to a rear face of the semiconductor substrate through a through hole of the semiconductor substrate.
Abstract:
PROBLEM TO BE SOLVED: To provide a photodiode array with excellent characteristics.SOLUTION: A photodiode array includes: a resistor 4 in which one end is electrically connected to an avalanche photodiode and which is disposed on a light incident surface of the avalanche photodiode; a read-out portion 3a of a signal conducting wire that is connected to the other end the of resistor 4; a first insulating film 16a that is formed on an epitaxial semiconductor layer; and a second insulating film 16b that is formed on the first insulating film 16a. The resistor 4 is interposed between the first insulating film 16a and the second insulating film 16b, and the signal conducting wire 3 is provided on the second insulating film 16b.