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公开(公告)号：US20210088735A1
公开(公告)日：2021-03-25
申请号：US16948726
申请日：2020-09-30
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Kevin Leigh , Everett Salinas , John Franz
Abstract: Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.
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公开(公告)号：US10809466B2
公开(公告)日：2020-10-20
申请号：US16192445
申请日：2018-11-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin Leigh , Everett Salinas , John Franz
Abstract: Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.
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公开(公告)号：US10542640B1
公开(公告)日：2020-01-21
申请号：US16143775
申请日：2018-09-27
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Kevin B. Leigh , John Franz , Everett Salinas
Abstract: Liquid chamber housings are described herein. In one example, an apparatus for liquid chamber housings can include a first housing segment coupled to a first side of a board and a second housing segment coupled to a second side of the board to create a liquid chamber for a portion of the board between the first housing segment and the second housing segment.
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公开(公告)号：US10795096B1
公开(公告)日：2020-10-06
申请号：US16398747
申请日：2019-04-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , Everett Salinas
Abstract: A line-card comprising: an optical blindmate connector to connect to the midplane of the switch sub-chassis; and a printed circuit board (PCB) including: an application specific integrated circuit (ASIC); an electrical blindmate connector to connect to a midplane of a switch sub-chassis; and a liquid blindmate connector to connect to the switch sub-chassis.
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公开(公告)号：US10765038B1
公开(公告)日：2020-09-01
申请号：US16525854
申请日：2019-07-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , John Norton , Everett Salinas
Abstract: A system may include a component cage to house a heat-generating component, a cold plate assembly, and a mounting mechanism. The cold plate assembly may include a cold plate having a mating surface and a non-mating surface, the mating surface to contact a thermal transfer device of a heat-generating component installed in the component cage. The mounting mechanism movably mounts the cold plate to the component cage with the non-mating surface facing a surface of the component cage located in a first plane. The mounting mechanism allows the cold plate to move from a first orientation to a second orientation as the heat-generating component is being installed in the component cage. In the first orientation, the mating surface is inclined relative to the first plane. In the second orientation, the mating surface is parallel to the first plane when the heat-generating component is installed in the component cage.
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Patent Agency Ranking
公开(公告)号：US12105330B2
公开(公告)日：2024-10-01
申请号：US16948726
申请日：2020-09-30
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Kevin Leigh , Everett Salinas , John Franz
CPC classification number: G02B6/3897 , G02B6/4452 , G02B6/4453 , H01R12/7005 , H05K7/1454 , H05K7/1492
Abstract: Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.
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公开(公告)号：US11417451B2
公开(公告)日：2022-08-16
申请号：US17073022
申请日：2020-10-16
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John Franz , Harvey J. Lunsman , Everett Salinas
Abstract: Example implementations relate to an electronic system providing a thermal management of a removable device when connected to a host device of the electronic system. The host device includes a cooling component having a first surface, and a plurality of first blocks of magnetic materials coupled to the cooling component. The removable device includes a heat spreader having a second surface, a plurality of second blocks of magnetic materials coupled to the heat spreader, and a TIM disposed on the second surface. The removable device is detachably connectable to the host device. When the removable device is connected to the host device, and magnetic forces applied by at least one of the first blocks or second blocks to couple respective blocks to each other, the first blocks is aligned with the second blocks such that the first surface is in thermal communication with the second surface through the TIM.
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公开(公告)号：US20220122751A1
公开(公告)日：2022-04-21
申请号：US17073022
申请日：2020-10-16
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John Franz , Harvey J. Lunsman , Everett Salinas
Abstract: Example implementations relate to an electronic system providing a thermal management of a removable device when connected to a host device of the electronic system. The host device includes a cooling component having a first surface, and a plurality of first blocks of magnetic materials coupled to the cooling component. The removable device includes a heat spreader having a second surface, a plurality of second blocks of magnetic materials coupled to the heat spreader, and a TIM disposed on the second surface. The removable device is detachably connectable to the host device. When the removable device is connected to the host device, and magnetic forces applied by at least one of the first blocks or second blocks to couple respective blocks to each other, the first blocks is aligned with the second blocks such that the first surface is in thermal communication with the second surface through the TIM.
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公开(公告)号：US11199669B1
公开(公告)日：2021-12-14
申请号：US17031428
申请日：2020-09-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , Everett Salinas , Kuang-Yi Wu
Abstract: A faceplate optical sub-assembly is provided for accommodating a plurality of optical receptacles mounted in a faceplate of a computing device. The faceplate optical sub-assembly accommodates one or more optical receptacle housings having optically-connected front and rear optical bays. A collar having a single aperture surrounds the one or more optical bays, and a shell structure comprised of a pair of interlocking sub-shells engages on the rear of the collar. A gasket is disposed between the collar and the shell structure. The collar, gasket, and shell structure provide electromagnetic interference (EMI) shielding for optical connections made between optical fibers inserted in the front and rear optical bays, and rigidly engage the plurality of optical receptacle housings. The single aperture of the collar and the multi-part shell structure allows for insertion of a fiber jumper assembly into the rear bays of the faceplate optical sub-assembly prior to insertion into a faceplate of a computing device.
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公开(公告)号：US10681832B1
公开(公告)日：2020-06-09
申请号：US16433857
申请日：2019-06-06
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Kevin B. Leigh , Everett Salinas , Richard Barnett , Michael Chan
Abstract: A high-density universally-configurable system board architecture for use with multiple mid-board optic (MBO) type configurations is provided. The system board comprises a switch application specific integrated circuit (ASIC) assembly, a plurality of MBO interfaces comprising a plurality of via-in-pad plated over (VIPPO) vias, and a plurality of mounting holes. Each MBO interface is configured to mate with a soldered-down MBO assembly or a socket instance comprising a socketized MBO assembly. Each socketized MBO assembly comprises an interposer comprising a plurality of VIPPO vias, where the bottom contact pad of each VIPPO via is thicker than the top contact pad. Either configuration is facilitated without the need to modify the system board layout.
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