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公开(公告)号：US20180124951A1
公开(公告)日：2018-05-03
申请号：US15568067
申请日：2015-05-29
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： David A. Moore , John Franz , Guillermo A. Gomez
IPC: H05K7/20
Abstract: A water wall is provided herein. An example water wall includes a top member, a thermal member, an orifice member, and a manifold member. The top member to expose a portion of a thermal module. The thermal member to position and hold the thermal module in the water wall. The orifice member to provide a supply passage and a return passage to the thermal module. The, manifold member to distribute fluid across the water wall.
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