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公开(公告)号：US20200375054A1
公开(公告)日：2020-11-26
申请号：US16418228
申请日：2019-05-21
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kenny H. Pham , Minh H. Nguyen , Earl W. Moore , Keith Sauer
Abstract: An apparatus includes: a 1U drive chassis divided into a plurality of compartments by a partition, the plurality of compartments including an interior compartment; an interior cage installed in the interior compartment, the interior cage including a plurality of pockets into which storage media are mounted when in use and having a back edge; a hinge by which the interior cage is rotatably mounted to the 1U drive chassis along the back edge of the interior cage; a lift to rotate the interior cage at least partially to an open position when the first latch is released; and a latch to maintain the interior cage in a closed position and to maintain the interior cage in the opened position according to the rotation of the interior compartment.
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公开(公告)号：US20200137917A1
公开(公告)日：2020-04-30
申请号：US16176677
申请日：2018-10-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin Peter Bold , Andrew Nathan Bulgerin , Minh H. Nguyen
IPC: H05K7/14
Abstract: Systems and devices for mounting servers are provided. In one aspect, a rack mounting system includes a first mounting bracket attached to a rack. The rack comprises a rack front side and a rack rear side opposite the rack front side. The first mounting bracket is attached to the rack rear side. A rail bracket is attached to a server component mounted in the rack. A second mounting bracket comprises a first end and a second end. The first end is coupled to the first mounting bracket. The second end is coupled to the rail bracket. The second mounting bracket comprises a first surface and a second surface opposite the first surface. The first surface of the second mounting bracket contacts the first mounting bracket. The second surface of the second mounting bracket contacts the rail bracket.
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公开(公告)号：US20160350255A1
公开(公告)日：2016-12-01
申请号：US15116671
申请日：2014-04-04
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Brian T. Purcell , David M. Koonce , Minh H. Nguyen
CPC classification number: G06F13/4081 , G06F1/206 , G06F13/20 , G06F13/4282 , H05K7/1492
Abstract: In one example implementation according to aspects of the present disclosure, a server chassis may include a server zone to receive a plurality of blade servers, each of the plurality of blade servers having a fabric connection. The server chassis may further include a flexible input/output zone to receive an input/output card, the input/output card being communicatively coupled to each of the plurality of blade servers via the fabric connection of each of the plurality of blade servers. The functionality of the input/output card may be distributed across the plurality of blade servers.
Abstract translation: 在根据本公开的方面的一个示例实现中，服务器机箱可以包括用于接收多个刀片服务器的服务器区域，所述多个刀片服务器中的每一个具有织物连接。 服务器机箱还可以包括用于接收输入/输出卡的灵活的输入/输出区域，输入/输出卡通过多个刀片服务器中的每一个的结构连接而通信地耦合到多个刀片服务器中的每一个。 输入/输出卡的功能可以分布在多个刀片服务器上。
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公开(公告)号：US11388830B2
公开(公告)日：2022-07-12
申请号：US16418228
申请日：2019-05-21
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kenny H. Pham , Minh H. Nguyen , Earl W. Moore , Keith Sauer
Abstract: An apparatus includes: a 1 U drive chassis divided into a plurality of compartments by a partition, the plurality of compartments including an interior compartment; an interior cage installed in the interior compartment, the interior cage including a plurality of pockets into which storage media are mounted when in use and having a back edge; a hinge by which the interior cage is rotatably mounted to the 1 U drive chassis along the back edge of the interior cage; a lift to rotate the interior cage at least partially to an open position when the first latch is released; and a latch to maintain the interior cage in a closed position and to maintain the interior cage in the opened position according to the rotation of the interior compartment.
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公开(公告)号：US20200241609A1
公开(公告)日：2020-07-30
申请号：US16256314
申请日：2019-01-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： David A. Selvidge , Pinche Tsai , David Scott Chialastri , Minh H. Nguyen
Abstract: A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.
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Patent Agency Ranking
公开(公告)号：US20240365499A1
公开(公告)日：2024-10-31
申请号：US18309207
申请日：2023-04-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Minh H. Nguyen , Earl W. Moore , Keith Allen Sauer
CPC classification number: H05K7/1489 , H05K5/0217 , H05K7/18
Abstract: A modular rear panel system for a chassis of an electronic device includes modular brackets and modular rear panel sections. The brackets are each configured to be selectively coupled to the chassis at a corresponding one of multiple bracket mounting locations. The rear panel sections are each configured to be selectively coupled to one or more corresponding ones of the modular brackets. The brackets and the plurality of rear panel sections comprise, i.e., can be grouped into, multiple different combinations, with each combination comprising a subset of the rear panel sections and subset of the brackets that can be assembled together to form a rear panel of the chassis, with the subset of brackets coupled to the mounting locations and the subset of rear panel sections coupled to the subset of brackets. The respective rear panels formable by the plurality of combinations have mutually different rear panel configurations.
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公开(公告)号：US12133349B2
公开(公告)日：2024-10-29
申请号：US17889198
申请日：2022-08-16
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Vincent Nguyen , Minh H. Nguyen , Kuan-Wei Chen
IPC: H05K7/14 , G01R31/3185 , G06F1/18 , G06F9/4401 , G06F13/40 , H05K1/02 , H05K1/11 , H05K5/02 , H05K5/04
CPC classification number: H05K7/1427
Abstract: One aspect of the instant application describes a system that includes a plurality of stacked mezzanine boards communicatively coupled to a motherboard and a metal enclosure enclosing the motherboard and mezzanine boards. A respective mezzanine board can include a number of solder pads, and the metal enclosure can include a plurality of metal strips, a respective metal strip to make contact with a solder pad of a corresponding mezzanine board. The system can further include a logic module positioned on the respective mezzanine board to determine a location of the respective mezzanine board based on a contact pattern between the metal strips and solder pads of the respective mezzanine board.
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公开(公告)号：US10925186B2
公开(公告)日：2021-02-16
申请号：US16413325
申请日：2019-05-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： David A. Selvidge , Pinche Tsai , Minh H. Nguyen
Abstract: Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.
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公开(公告)号：US10791655B2
公开(公告)日：2020-09-29
申请号：US15570692
申请日：2016-01-22
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Tahir Cader , Minh H. Nguyen
IPC: H05K7/20 , H01L23/34 , G06F1/20 , H01L23/473
Abstract: Examples herein disclose a system including a board and a cooling member. The board includes a first surface, a second surface, and a midpoint between the first and the surface, the boards supports an electrical component on the first surface. The cooling member is routed along the second surface of the board and delivers cooling liquid to the electrical component by crossing the midpoint of the board from the second surface to the first surface. The cooling member routes heated liquid from the electrical component by crossing the midpoint of the board from the first surface to the second surface.
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公开(公告)号：US10791646B2
公开(公告)日：2020-09-29
申请号：US16176677
申请日：2018-10-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin Peter Bold , Andrew Nathan Bulgerin , Minh H. Nguyen
IPC: H05K7/14
Abstract: Systems and devices for mounting servers are provided. In one aspect, a rack mounting system includes a first mounting bracket attached to a rack. The rack comprises a rack front side and a rack rear side opposite the rack front side. The first mounting bracket is attached to the rack rear side. A rail bracket is attached to a server component mounted in the rack. A second mounting bracket comprises a first end and a second end. The first end is coupled to the first mounting bracket. The second end is coupled to the rail bracket. The second mounting bracket comprises a first surface and a second surface opposite the first surface. The first surface of the second mounting bracket contacts the first mounting bracket. The second surface of the second mounting bracket contacts the rail bracket.
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