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公开(公告)号：WO2019017925A1
公开(公告)日：2019-01-24
申请号：PCT/US2017/042719
申请日：2017-07-19
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： SCHMALE, Joshua , WINBURNE, Robert Lawrence , REGNIER, Tait A. , DUDA, Michael , ROMAN, Justin M.
Abstract: In one example in accordance with the present disclosure, an additive manufacturing platform is described. The additive manufacturing platform includes a vibrating bed on which a volume of build material is to be disposed. The bed is to vibrate to remove excess build material and operates in at least two extraction modes during a build material extraction period. The additive manufacturing platform also includes a non-vibrating frame to support the vibrating bed.
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公开(公告)号：WO2019209282A1
公开(公告)日：2019-10-31
申请号：PCT/US2018/029299
申请日：2018-04-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： ROMAN, Justin M. , ALONSO BECERRO, Xavier , KRASOWSKI, Wojciech Jerzy , TELFER, Neil , DUDA, Michael
Abstract: There is disclosed a method of cooling a bed of build material 12, 14 generated by additive manufacture. A container 10 containing a bed of build material may be provided, the bed having a hot region relative to ambient temperature. The container may be vibrated to fluidize unfused build material 12 in the container so as to cause convection of the unfused build material to cool the hot region. There is also disclosed a method of cooling a bed of build material 12, 14 including vibration when the temperature of a hot region in the bed of build material is higher than an unpacking threshold. There is also disclosed a cooling apparatus for cooling a bed of build material by vibration.
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公开(公告)号：WO2020023006A1
公开(公告)日：2020-01-30
申请号：PCT/US2018/043296
申请日：2018-07-23
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： DUDA, Michael , ROMAN, Justin M. , SOSNOWSKI, Luke P.
IPC: B29C64/364 , B33Y40/00 , G05D22/00
Abstract: An example three-dimensional printer includes a humidity source, a build material reservoir, a conduit between the humidity source and the build material reservoir, an air source to transfer air from the humidity source through the conduit towards the build material reservoir, and a valve assembly connected to the conduit to control a flow of the air in the conduit while the printer enters an inactive mode of operation. The air source is to remain in an active mode of operation. The air source is controlled to transmit the air in the conduit until the air in the conduit adjacent to the build material reservoir reaches a temperature and relative humidity threshold.
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Patent Agency Ranking
公开(公告)号：WO2018199894A1
公开(公告)日：2018-11-01
申请号：PCT/US2017/029131
申请日：2017-04-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： DUDA, Michael , ROMAN, Justin M. , PICKARD, Joel V.
IPC: B29C64/153 , B29C64/20 , B29C64/227 , B33Y30/00 , B33Y80/00
Abstract: A three-dimensional (3D) printer and method of additive manufacture are disclosed. The method includes building a three-dimensional (3D) object via a 3D printing process. After the 3D printing process, the 3D object is contained within a cake comprising the 3D object and partially fused excess build material. The method further includes vibrating the cake to loosen the excess build material. The frequency of the vibration is swept across a predetermined range of frequencies over a predetermined sweep interval.
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公开(公告)号：WO2018118032A1
公开(公告)日：2018-06-28
申请号：PCT/US2016/067912
申请日：2016-12-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： ROMAN, Justin M , DUDA, Michael , BEAUCHAMP, Robert , SCHALK, Wesley R
CPC classification number: B33Y30/00 , B08B5/04 , B08B7/02 , B29C64/153 , B29C64/35 , B29C64/40 , B33Y10/00 , B33Y40/00 , G06F17/50
Abstract: In an example implementation, a method of extracting three-dimensional (3D) objects includes forming on a vibratory extraction platform, a build cake comprising a fused 3D object encased within build material and vibrating the extraction platform to break apart the build material and sift it through openings in the extraction platform.
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公开(公告)号：EP3558642A1
公开(公告)日：2019-10-30
申请号：EP16924415.9
申请日：2016-12-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： ROMAN, Justin M , DUDA, Michael , BEAUCHAMP, Robert , SCHALK, Wesley R
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公开(公告)号：EP3565706A1
公开(公告)日：2019-11-13
申请号：EP17907113.9
申请日：2017-04-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： DUDA, Michael , ROMAN, Justin M. , PICKARD, Joel V.
IPC: B29C64/153 , B29C64/20 , B29C64/227 , B33Y30/00 , B33Y80/00
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公开(公告)号：EP3609682A1
公开(公告)日：2020-02-19
申请号：EP17917914.8
申请日：2017-07-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： SCHMALE, Joshua , WINBURNE, Robert Lawrence , REGNIER, Tait A. , DUDA, Michael , ROMAN, Justin M.
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