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公开(公告)号：WO2021216033A1
公开(公告)日：2021-10-28
申请号：PCT/US2020/028927
申请日：2020-04-20
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： WITTKOPF, Jarrid , ERICKSON, Kristopher J. , LUNA-RAMIREZ, Eric , STASIAK, James W.
IPC: G06T19/20 , B29C64/393 , B33Y50/02
Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to form a 3D printed capacitor on a body of the 3D printed object. The controller does this by controlling deposition of a conductive agent to form electrodes of the 3D printed capacitor and by controlling deposition of a dielectric agent in a dielectric region between the electrodes of the 3D printed capacitor.
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公开(公告)号：WO2022031265A1
公开(公告)日：2022-02-10
申请号：PCT/US2020/044786
申请日：2020-08-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
IPC: B29C64/364 , B29C64/393 , B33Y50/02 , B33Y40/00
Abstract: In one example in accordance with the present disclosure, a three-dimensional (3D) printed sensor system is described. The 3D printed sensor system includes a 3D printed object. The 3D printed sensor system also includes a 3D printed sensor on a body of the 3D printed object. The 3D printed sensor includes a dielectric region disposed between electrodes. A capacitance of the dielectric region is indicative of an environmental condition of the 3D printed object. The 3D printed sensor system also includes a controller integrated with the body of the 3D printed object. The controller is to measure a capacitance of the 3D printed sensor.
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公开(公告)号：EP4115396A1
公开(公告)日：2023-01-11
申请号：EP20932204.9
申请日：2020-04-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： WITTKOPF, Jarrid , ERICKSON, Kristopher J. , LUNA-RAMIREZ, Eric , STASIAK, James W.
IPC: G06T19/20 , B29C64/393 , B33Y50/02
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