公开(公告)号：US11642847B2

公开(公告)日：2023-05-09

申请号：US17680661

申请日：2022-02-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

CPC classification number: B29C64/245 ,  B29C64/321 ,  B33Y30/00 ,  B33Y40/00

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US20200147885A1

公开(公告)日：2020-05-14

申请号：US16741972

申请日：2020-01-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jordi Gimenez Manent ,  Jose Manuel Grases ,  Francisco Jaime ,  Fernando Juan ,  Pau Martin Vidal ,  Marius Valles

IPC: B29C64/329 ,  B29C64/153 ,  B33Y40/00 ,  B33Y30/00 ,  B33Y10/00 ,  B29C64/20

Abstract: According to one example there is provided a method of delivering build material from a build material store to a supply module. The method comprises moving, using a rotatable vane, a portion of build material from the supply module to the top of the supply module, and spreading the moved portion of build material across the support platform.

公开(公告)号：US11325312B2

公开(公告)日：2022-05-10

申请号：US16062854

申请日：2016-03-24

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Miguel Angel Lopez ,  Pau Martin Vidal ,  Carlos Perez ,  Anna Torrent ,  Guillermo Garcia Marcos ,  Marius Valles ,  Albert Mora Murciano

IPC: B29C64/393 ,  G01F23/292 ,  B33Y30/00 ,  B33Y50/02 ,  G01B11/02 ,  B29C64/321 ,  B29C64/165 ,  B33Y10/00 ,  B29C64/141 ,  B29C64/205

Abstract: There is disclosed a build material supply unit, comprising: a supply chamber body enclosing a supply volume to contain a build material for additive manufacture; an electromagnetic distance sensor to determine a length parameter relating to a length of a beam pathway extending from an emitter of the sensor to a surface level of build material in the supply volume; and a reflector to reflect the beam pathway between the emitter and the surface level of build material; wherein the reflector is spaced apart from the emitter.

公开(公告)号：US11285668B2

公开(公告)日：2022-03-29

申请号：US16084141

申请日：2016-05-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US11745430B2

公开(公告)日：2023-09-05

申请号：US16094272

申请日：2016-05-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Pau Martin ,  Francesc Salas Roura ,  Anna Torrent ,  Marius Valles

IPC: B29C64/393 ,  B29C64/386 ,  B33Y50/00 ,  B29C64/245 ,  B29C64/241 ,  G06F1/03 ,  G06F17/18 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B29C64/393 ,  B29C64/241 ,  B29C64/245 ,  B29C64/386 ,  B33Y50/00 ,  G06F1/03 ,  G06F17/18 ,  B33Y30/00 ,  B33Y50/02

Abstract: A method of calibrating movement of a platform is described, the method comprising: in a calibration run, causing movement of the platform; detecting a plurality of positions of the platform during the movement; deriving a movement pattern from the plurality of positions; and determining an adjustment of the movement of the platform based on the movement pattern.

公开(公告)号：US20200290274A1

公开(公告)日：2020-09-17

申请号：US16084141

申请日：2016-05-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US20190134912A1

公开(公告)日：2019-05-09

申请号：US16095797

申请日：2016-07-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Fernando Juan ,  Sergi Culubret ,  Marius Valles ,  Gerard Mosquera

IPC: B29C64/393 ,  B29C64/165 ,  B29C64/245 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: Methods and devices for setting a printing distance in a 3D printing system are disclosed. In one example the method comprises forming a layer of build material below a printing plane and relatively displacing the formed layer of build material with respect to the printing plane until the distance between the formed layer of build material and the printing plane is a desired printing distance.

公开(公告)号：US20220176629A1

公开(公告)日：2022-06-09

申请号：US17680661

申请日：2022-02-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US11260591B2

公开(公告)日：2022-03-01

申请号：US16741972

申请日：2020-01-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jordi Gimenez Manent ,  Jose Manuel Grases ,  Francisco Jaime ,  Fernando Juan ,  Pau Martin Vidal ,  Marius Valles

IPC: B29C64/214 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/329 ,  B29C64/153 ,  B29C64/218

Abstract: According to one example there is provided a method of delivering build material from a build material store to a supply module. The method comprises moving, using a rotatable vane, a portion of build material from the supply module to the top of the supply module, and spreading the moved portion of build material across the support platform.

公开(公告)号：US10569467B2

公开(公告)日：2020-02-25

申请号：US15565648

申请日：2015-07-07

Applicant: Hewlett-Packard Development Company, L.P. ,  Jordi Gimenez Manent ,  Jose Manuel Grases ,  Francisco Jaime ,  Fernando Juan ,  Pau Martin Vidal ,  Marius Valles

Inventor： Jordi Gimenez Manent ,  Jose Manuel Grases ,  Francisco Jaime ,  Fernando Juan ,  Pau Martin Vidal ,  Marius Valles

IPC: B29C64/329 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/20 ,  B29C64/153 ,  B29C64/218

Abstract: A method of delivering build material from a build material store (404) to a supply module (102). The method comprises moving, using a rotatable vane (116), a portion of build material from the supply module (102) to the top of the supply module (102), and spreading the moved portion of build material across the support platform (104).