公开(公告)号：US11325308B2

公开(公告)日：2022-05-10

申请号：US16603552

申请日：2017-09-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kevin E Swier ,  Steve Ringwald ,  Kevin Hulick ,  Gunay Ozturk

IPC: B29C64/343 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/329 ,  B29C64/153

Abstract: In an example implementation, a powder metering device to move powder in a 3D printing system includes a rotor comprising a central hub and peripheral wheel to rotate about a shaft. Compartments are formed between the hub and the wheel by a plurality of fins that emanate from the hub at first fin ends and affix to the wheel at second fin ends. A top and bottom disk each have a planar surface to lie flush against and to seal, respectively, top and bottom perimeters of each compartment as the compartments rotate about the shaft between a powder receiving position and a powder dispensing position.

公开(公告)号：US11660808B2

公开(公告)日：2023-05-30

申请号：US16607919

申请日：2018-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David Soriano ,  Douglas Pederson ,  Nicola Baldo ,  Steve Ringwald ,  Samrin Sing ,  Matthew Baker

IPC: B29C64/153 ,  B33Y40/00 ,  B33Y50/00 ,  B29C64/386 ,  B29C64/35 ,  B22F12/50 ,  B22F12/90 ,  B22F10/30 ,  B33Y10/00 ,  B22F10/14 ,  B22F12/10

CPC classification number: B29C64/153 ,  B22F10/30 ,  B22F12/50 ,  B22F12/90 ,  B29C64/35 ,  B29C64/386 ,  B33Y40/00 ,  B33Y50/00 ,  B22F10/14 ,  B22F12/10 ,  B33Y10/00

Abstract: In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.

公开(公告)号：US20210402695A1

公开(公告)日：2021-12-30

申请号：US16607919

申请日：2018-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David Soriano ,  Douglas Pederson ,  Nicola Baldo ,  Steve Ringwald ,  Samrin Sing ,  Matthew Baker

IPC: B29C64/35 ,  B29C64/153 ,  B29C64/386 ,  B33Y40/00 ,  B33Y50/00

Abstract: In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.

公开(公告)号：US20210283846A1

公开(公告)日：2021-09-16

申请号：US16608853

申请日：2017-12-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David R. Otis, JR. ,  Steve Ringwald ,  Kevin E. Swier

IPC: B29C64/357 ,  B29C64/255 ,  B29C64/393 ,  B29C64/329 ,  B22F12/52 ,  B22F12/90 ,  B22F10/73 ,  B22F10/85 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y40/00

Abstract: A build device and a method of operating the build device are disclosed. In a method provided, a build material is directed to an intermediate vessel from a conveying line. The build material is separated from an air stream and dropped into the intermediate vessel. The intermediate vessel is emptied between a first build operation and a second build operation.