公开(公告)号：WO2019194823A1

公开(公告)日：2019-10-10

申请号：PCT/US2018/026523

申请日：2018-04-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： ROMAN, Justin M. ,  SOSNOWSKI, Luke ,  SORIANO, David ,  TOLOSA GONZALEZ, Emiliano Gabriel

IPC: B29C64/20 ,  B33Y30/00 ,  B29C64/393 ,  B33Y50/02 ,  B29C64/357

Abstract: A system for manufacturing three dimensional objects can include logic to detect, for at least one vessel, a moisture content level corresponding to a build material residing in the at least one vessel. The logic can also adjust a humidity level and a temperature of a gas and a conditioning agent applied to the at least one vessel, wherein the humidity level and the temperature are based on the moisture content level and a temperature of the build material residing in the at least one vessel. Additionally, the logic can initialize manufacturing a three dimensional object with the build material from the at least one vessel in response to detecting the moisture content level of the build material residing in the at least one vessel is within a predetermined range.

公开(公告)号：WO2019194824A1

公开(公告)日：2019-10-10

申请号：PCT/US2018/026530

申请日：2018-04-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： SOSNOWSKI, Luke ,  ROMAN, Justin M. ,  SORIANO, David ,  TOLOSA GONZALEZ, Emiliano Gabriel

IPC: B29C64/255 ,  B33Y40/00 ,  G05D22/00 ,  B29C64/364 ,  B29C64/357

Abstract: Techniques for controlling moisture content of build material in a three dimensional printer are provided. An example system includes a build material vessel to contain the build material and receive a flow of air, and a humidifier to adjust the humidity of the air flowing into the build material vessel. The system also includes one or more sensors to determine a dew point of the air flowing into the build material vessel. The humidity level of the air flowing into the hopper is controlled by the humidifier to maintain the dew point at a level that will prevent condensation of water inside the build material vessel.

公开(公告)号：EP3713742A1

公开(公告)日：2020-09-30

申请号：EP18913884.5

申请日：2018-04-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： ROMAN, Justin M. ,  SOSNOWSKI, Luke ,  SORIANO, David ,  TOLOSA GONZALEZ, Emiliano Gabriel

IPC: B29C64/20 ,  B33Y30/00 ,  B29C64/393 ,  B33Y50/02 ,  B29C64/357