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公开(公告)号:WO2017018977A1
公开(公告)日:2017-02-02
申请号:PCT/US2015/041896
申请日:2015-07-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: WEBER, Timothy L.
CPC classification number: G01N21/05 , B01L3/50273 , B01L2300/0816 , B01L2400/0442 , B81B1/00 , B81B7/02 , G01N21/11 , G01N21/59 , G01N21/6428 , G01N2021/0328 , G01N2021/0346 , G01N2021/6439 , G01N2021/7783 , G01N2021/7786 , G01N2201/0221 , G01N2201/024 , G01N2201/0873
Abstract: In one example, testing cells extend along a length of a slot. Each testing cell includes a microfluidic channel extending from the slot, a pump to move fluid from the slot into the channel, a discharge nozzle through which fluid exits the channel, a fluid discharger to discharge fluid from the channel through the nozzle and a photosensor. A light guide is provided to receive light from an external light source and is to serially transmit the light to the microfluidic channel of each of the plurality of testing cells.
Abstract translation: 在一个示例中,测试单元沿着时隙的长度延伸。 每个测试单元包括从槽延伸的微流体通道,将流体从槽移动到通道中的泵,流体离开通道的排出喷嘴,流体通过喷嘴和光传感器从流体排出流体的流体排放器。 提供光导以接收来自外部光源的光,并且将光串联传输到多个测试单元中的每一个的微流体通道。
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公开(公告)号:WO2018080441A1
公开(公告)日:2018-05-03
申请号:PCT/US2016/058608
申请日:2016-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: DEKAM, Kevin P. , WEBER, Timothy L. , CHAFFINS, Sterling
Abstract: A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor.
Abstract translation: 温度传感器可以包括电阻器,在电阻器的第一端处的第一电触点,在电阻器的第二端处的第二电触点以及电阻测量装置。 电阻器可以由与熔融热塑性聚合物颗粒基体互锁的烧结元素过渡金属颗粒基体形成。 电阻测量装置可以连接到第一电触点和第二电触点以测量电阻器的电阻。 p>
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公开(公告)号:WO2022256015A1
公开(公告)日:2022-12-08
申请号:PCT/US2021/035795
申请日:2021-06-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: WILSON, Karsten N. , DISCEKICI, Emre Hiro , KASPERCHIK, Vladek , WEBER, Timothy L. , KOWALSKI, Mark , CHAFFINS, Sterling , MOUREY, Devin Alexander
IPC: B29C64/165 , B33Y10/00 , B33Y70/10 , B33Y80/00
Abstract: A method of three-dimensional printing can include iteratively applying a polymer build material as individual layers to a powder bed, where the polymer build material includes from about 80 wt% to 100 wt% polymeric particles, and based on a three-dimensional object model, selectively applying a coalescing agent onto individual layers of the polymer build material. The coalescing agent can include an aqueous liquid vehicle and a coalescing solvent that depresses a melting point of the polymeric particles. The method can include exposing the powder bed to heat to selectively coalesce portions of individual layers of the polymer build material in contact with the coalescing solvent. The heat may not be sufficient to coalesce the polymer build material that is not in contact with the coalescing solvent and may be sufficient to fuse the polymeric particles in contact with the coalescing solvent together to form a three-dimensional object.
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公开(公告)号:WO2022256014A1
公开(公告)日:2022-12-08
申请号:PCT/US2021/035775
申请日:2021-06-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: WILSON, Karsten N. , DISCEKICI, Emre Hiro , KASPERCHIK, Vladek , WEBER, Timothy L. , CHAFFINS, Sterling , MOUREY, Devin Alexander
IPC: B29C64/165 , B33Y10/00 , B33Y70/00
Abstract: Methods of three-dimensional printing can include iteratively applying a polymer build material as individual layers to a powder bed, where the polymer build material includes from about 80 wt% to 100 wt% polymer build particles, and based on a three-dimensional object model, selectively applying a binder agent including an aqueous liquid vehicle and polymer binder particles onto the individual layers of the polymer build material. The polymer binder particles have or are capable of having a melting temperature lower than a melting temperature of the polymer build particles. The methods can include exposing the powder bed to heat at a temperature less than a melting point of the polymer build particles but greater than a melting temperature of the polymer binder particles. The heat causes the polymer binder particles to melt to adhere the polymer build particles together to form a three-dimensional object.
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公开(公告)号:WO2018194645A1
公开(公告)日:2018-10-25
申请号:PCT/US2017/028796
申请日:2017-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: WEBER, Timothy L. , MCKINNELL, James , SHAARAWI, Mohammed S. , CHAMPION, David A.
IPC: B29C64/141 , B29C64/314 , B02C19/18 , B33Y40/00
Abstract: A device for forming spherical particles may include a receiving chamber having a heating portion and a cooling portion. Wire segments may travel in a free fall through the receiving chamber. While falling through the heating portion, wire segments may be heated to form spherical particles in response to exposure to microwave electromagnetic radiation. While falling through the cooling portion, formed spherical particles cool.
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公开(公告)号:EP3325944A1
公开(公告)日:2018-05-30
申请号:EP15899779.1
申请日:2015-07-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: WEBER, Timothy L.
Abstract: In one example, testing cells extend along a length of a slot. Each testing cell includes a microfluidic channel extending from the slot, a pump to move fluid from the slot into the channel, a discharge nozzle through which fluid exits the channel, a fluid discharger to discharge fluid from the channel through the nozzle and a photosensor. A light guide is provided to receive light from an external light source and is to serially transmit the light to the microfluidic channel of each of the plurality of testing cells.
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公开(公告)号:EP3962680A1
公开(公告)日:2022-03-09
申请号:EP19927087.7
申请日:2019-04-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: STASIAK, James W. , HINCH, Garry D. , WEBER, Timothy L.
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公开(公告)号:EP3325944B1
公开(公告)日:2019-12-11
申请号:EP15899779.1
申请日:2015-07-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: WEBER, Timothy L.
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公开(公告)号:EP3533072A1
公开(公告)日:2019-09-04
申请号:EP16920048.2
申请日:2016-10-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: DEKAM, Kevin P. , WEBER, Timothy L. , CHAFFINS, Sterling
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