公开(公告)号：WO2015030806A1

公开(公告)日：2015-03-05

申请号：PCT/US2013/057629

申请日：2013-08-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP

Inventor： MCKAY JR, Roger A. ,  SADIK, Patrick Wayne

IPC: B81C1/00 ,  H01L21/302

CPC classification number: C25F3/12 ,  B81C1/00626 ,  B81C2201/0133 ,  C25F3/14 ,  C25F7/00

Abstract: An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.

Abstract translation: 一个实例提供了一种方法，包括将金属催化剂溅射到衬底上，将衬底暴露于与金属催化剂反应以在衬底中形成多个孔的溶液，以及蚀刻衬底以除去多个孔以形成凹部 在基材中。