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公开(公告)号:AU2015308138A1
公开(公告)日:2017-03-16
申请号:AU2015308138
申请日:2015-08-26
Applicant: HIGHCON SYSTEMS LTD
Inventor: BEN-DAVID DAVID , IRENI ELI , ZIMMER MICHAEL
Abstract: Methods and apparatus for stripping away portions of substrate are disclosed herein. In some embodiments, a flexible and/or soft impact-element(s) rotates around a rotation axis to drive a peripheral portion across a substrate plane of the substrate and/or to repeatedly collide with the substrate. At least some of the collisions are effective to partially dislodge or to strip away portion(s) of substrate.
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公开(公告)号:AU2013319776B2
公开(公告)日:2017-11-02
申请号:AU2013319776
申请日:2013-09-16
Applicant: HIGHCON SYSTEMS LTD
Inventor: ZIMMER MICHAEL
Abstract: A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.
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公开(公告)号:PL2572037T3
公开(公告)日:2017-09-29
申请号:PL11783164
申请日:2011-05-17
Applicant: HIGHCON SYSTEMS LTD
Inventor: IDAN DAVID , ZIMMER MICHAEL , RATZMAN AVIV , SPIRYAGIN KOSTANTIN , DAHAN LIOR
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公开(公告)号:CA2884647A1
公开(公告)日:2014-03-27
申请号:CA2884647
申请日:2013-09-16
Applicant: HIGHCON SYSTEMS LTD
Inventor: ZIMMER MICHAEL
Abstract: A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.
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公开(公告)号:AU2015308138B2
公开(公告)日:2020-05-21
申请号:AU2015308138
申请日:2015-08-26
Applicant: HIGHCON SYSTEMS LTD
Inventor: BEN-DAVID DAVID , IRENI ELI , ZIMMER MICHAEL
Abstract: Methods and apparatus for stripping away portions of substrate are disclosed herein. In some embodiments, a flexible and/or soft impact-element(s) rotates around a rotation axis to drive a peripheral portion across a substrate plane of the substrate and/or to repeatedly collide with the substrate. At least some of the collisions are effective to partially dislodge or to strip away portion(s) of substrate.
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公开(公告)号:ES2718182T3
公开(公告)日:2019-06-28
申请号:ES13839056
申请日:2013-09-16
Applicant: HIGHCON SYSTEMS LTD
Inventor: ZIMMER MICHAEL
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公开(公告)号:AU2011254215B2
公开(公告)日:2016-05-19
申请号:AU2011254215
申请日:2011-05-17
Applicant: HIGHCON SYSTEMS LTD
Inventor: IDAN DAVID , ZIMMER MICHAEL , RATZMAN AVIV , SPIRYAGIN KOSTANTIN , DAHAN LIOR
IPC: C08L23/12 , C08F110/06 , C08G18/32 , C08G63/00 , C08G64/00 , C08G69/08 , C08K3/36 , C08K5/541 , C08L67/00 , C08L69/00 , C08L75/04 , C08L77/00
Abstract: A surface-adhesive-rule technology (SART) for creating a surface-adhesive-rule (SAR) die and counter die for pre-treating cardboard. Wherein the pre-treating comprises: creasing, cutting, embossing the cardboard. The SART system may comprise: a rule-drawer having one or more: cartridges, nozzles, and pressure actuator. A leading mechanism that carries the rule-drawer; and a controller that controls the rule-drawer and the leading mechanism according to a layout of a SAR die. Each cartridge may comprise flexible materiel and may be associated with a nozzle having an orifice with a profile. Further the leading mechanism moves the rule-drawer and the rule-drawer draws a plurality of surface-adhesive rules from the flexible material having an attribute to reserve the shape of the orifice profile through which it is deposited on the surface of a die's body according to commands obtained from the controller.
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公开(公告)号:AU2013319776A1
公开(公告)日:2015-03-12
申请号:AU2013319776
申请日:2013-09-16
Applicant: HIGHCON SYSTEMS LTD
Inventor: ZIMMER MICHAEL
Abstract: A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.
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公开(公告)号:EP3186044A4
公开(公告)日:2018-05-23
申请号:EP15835280
申请日:2015-08-26
Applicant: HIGHCON SYSTEMS LTD
Inventor: BEN-DAVID DAVID , IRENI ELI , ZIMMER MICHAEL
CPC classification number: B26D7/1818 , B26D5/28 , B26D7/18 , B26D7/32 , B26D2007/1809 , B31B1/24 , B31B50/14 , B31B50/20 , B31B50/83 , B31B2100/00 , B31B2110/35 , B31B2201/147 , B31B2203/066
Abstract: Methods and apparatus for stripping away portions of substrate are disclosed herein. In some embodiments, a flexible and/or soft impact-element(s) rotates around a rotation axis to drive a peripheral portion across a substrate plane of the substrate and/or to repeatedly collide with the substrate. At least some of the collisions are effective to partially dislodge or to strip away portion(s) of substrate.
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公开(公告)号:EP2897761A4
公开(公告)日:2016-06-15
申请号:EP13839056
申请日:2013-09-16
Applicant: HIGHCON SYSTEMS LTD
Inventor: ZIMMER MICHAEL
CPC classification number: B26D9/00 , B23K26/38 , B23K26/60 , B23K2203/40 , B23K2203/50 , B26D3/085 , B26D5/005 , B26F1/00 , B31B50/006 , B31B50/14 , B31B50/25 , B31B50/252 , B31F1/08
Abstract: A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.
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