公开(公告)号：US11705646B2

公开(公告)日：2023-07-18

申请号：US17000775

申请日：2020-08-24

Applicant: HIRAKAWA HEWTECH CORPORATION

Inventor： Hiroyuki Tanaka

IPC: G01J1/44 ,  H01R4/02 ,  H01R4/04

CPC classification number: H01R4/023 ,  G01J1/44 ,  H01R4/029 ,  H01R4/04 ,  G01J2001/448

Abstract: A connection structure between sensor and cable includes a cable formed by assembling a plurality of electric wires each including a covering portion covering a core and a core-exposing portion exposing the core at an end of the covering portion, a spacer that is interposed in a space surrounded by the covering portions of the electric wires and holds end portions of the covering portions in the state that the end portions are spaced from each other, and a sensor that detects a physical quantity, and the core-exposing portion of each of the electric wires of the cable is electrically connected to the sensor via a fixing member in the state that each of the electric wires is held by the spacer.