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公开(公告)号:GB2512468A
公开(公告)日:2014-10-01
申请号:GB201402502
申请日:2014-02-13
Applicant: HITACHI LTD
Inventor: SHIMAMURA KOTARO , SHIBATA NAOKI , KANEKAWA NOBUYASU , KURIHARA NAOKI
Abstract: Control equipment has a plurality of processing modules 101, 102 performing the same processing and whose results are compared to detect a malfunction in the processing modules. Transmission of data is cut off at the time of detection of the malfunction. A check code concatenation circuit 131 concatenates the processing result outputted by one module 101 with a check code generated on the basis of the result of another module 102, and outputs the processing result concatenated with the check code.
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公开(公告)号:DE69233063T2
公开(公告)日:2004-09-16
申请号:DE69233063
申请日:1992-02-27
Applicant: HITACHI LTD
Inventor: KANEKAWA NOBUYASU , IHARA HIROKAZU , AKIYAMA MASATSUGU , YAMANAKA HISAYOSHI , OKISHIMA TETSUYA , KAWABATA KIYOSHI
IPC: G06F3/00 , G06F11/10 , G06F1/18 , G06F11/22 , G06F12/16 , G06F15/78 , G11C5/00 , H01L23/495 , H01L23/50 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18
Abstract: An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chips packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayer. The bus line includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate.
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公开(公告)号:DE69233297D1
公开(公告)日:2004-03-04
申请号:DE69233297
申请日:1992-02-27
Applicant: HITACHI LTD
Inventor: KANEKAWA NOBUYASU , IHARA HIROKAZU , AKIYAMA MASATSUGU , KAWABATA KIYOSHI , YAMANAKA HISAYOSHI , OKISHIMA TETSUYA
IPC: G06F3/00 , G06F11/10 , G06F1/18 , G06F11/22 , G06F12/16 , G06F15/78 , G11C5/00 , H01L23/495 , H01L23/50 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18
Abstract: An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chips packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayer. The bus line includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate.
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公开(公告)号:DE69431374T2
公开(公告)日:2003-04-30
申请号:DE69431374
申请日:1994-10-12
Applicant: HITACHI LTD
Inventor: KANEKAWA NOBUYASU , SHOJI SUZUKI , SATO YOSHIMICHI , TASHIRO KOREFUMI , KEISUKE BEKKI , SATO HIROSHI , NOHMI MAKOTO , OHTSUJI SHINYA
IPC: G05B9/03 , G05B13/02 , G06F11/00 , G06F11/08 , G06F11/16 , G06F11/18 , G06F11/20 , G06F11/267 , G06F17/50 , H03K19/007
Abstract: The present invention relates to a self-checking circuit and a method of its configuration. More particularly, it concerns a self-checking circuit useful for highly reliable system configuration. As for a logic circuit having error detection function that has function blocks of feeding out a plurality of signals at least duplexed, compares the output signals of the function blocks, and detects an error on the basis of results of the comparison, it comprises synthesizing means provided to superimpose inherent waveforms assigned in advance to the respective output signals of the function blocks onto the output signals of one of the function blocks. The inherent waveforms are orthogonal waveforms generated by orthogonal waveform generator circuit. The logic circuit also comprises comparison means for comparing a signal output of the synthesizing means with the signal output of the other function block to detect the error. The whole circuit including the function blocks are judged normal only if the waveforms inherent to the both output signals exist.
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公开(公告)号:DE69718129D1
公开(公告)日:2003-02-06
申请号:DE69718129
申请日:1997-10-27
Applicant: HITACHI LTD
Inventor: KANEKAWA NOBUYASU , YAMAGUCHI SHINICHIRO , MIYAZAKI NAOTO , KASUYA NAOHIRO , KAJIGAYA KAZUHIKO , MIYAZAKI YOSHIHIRO
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公开(公告)号:CA2205528A1
公开(公告)日:1992-08-29
申请号:CA2205528
申请日:1992-02-27
Applicant: HITACHI LTD
Inventor: OKISHIMA TETSUYA , IHARA HIROKAZU , AKIYAMA MASATSUGU , YAMANAKA HISAYOSHI , KANEKAWA NOBUYASU , KAWABATA KIYOSHI
IPC: H05K1/16
Abstract: A data processing apparatus includes a microprocessor which processes data and outputs m bits of data simultaneously and a semiconductor chip module. The module has a plurality of memory chips having data width of n bits data formed on each side of a substrate. The apparatus further includes data lines connected to the microprocessor and the memory chips for slicing m bit data into n bit data and providing the sliced n bit data to each memory chip. The data of a data processing apparatus is transmitted by the microprocessor and the memory chips. The microprocessor outputs an address signal to the memory chips. One group of the memory chips outputs data upper n bits to the microprocessor in parallel based on the address signal. The other group of the memory chips outputs data of lower (m-n) bits to the microprocessor in parallel based on the address signal.
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公开(公告)号:CA2061949A1
公开(公告)日:1992-08-29
申请号:CA2061949
申请日:1992-02-27
Applicant: HITACHI LTD
Inventor: KANEKAWA NOBUYASU , IHARA HIROKAZU , AKIYAMA MASATSUGU , KAWABATA KIYOSHI , YAMANAKA HISAYOSHI , OKISHIMA TETSUYA
IPC: G06F1/18 , G06F3/00 , G06F11/10 , G06F11/22 , G06F12/16 , G06F15/78 , G11C5/00 , H01L23/495 , H01L23/50 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18 , H01L23/522
Abstract: An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chips packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayer. The bus line includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate.
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公开(公告)号:BR102013021720A2
公开(公告)日:2014-11-04
申请号:BR102013021720
申请日:2013-08-26
Applicant: HITACHI LTD
Inventor: KANEKAWA NOBUYASU , KATSUTA KEIICHI , SAKATA TERUAKI , IKEDA NAOHIRO , KURIHARA NAOKI , SHIMAMURA KOTARO
IPC: G06F11/16 , G01R31/3177 , G06F11/263
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公开(公告)号:DE69534349D1
公开(公告)日:2005-09-01
申请号:DE69534349
申请日:1995-12-20
Applicant: HITACHI LTD
Inventor: SATO HIROSHI , KANEKAWA NOBUYASU , NOHMI MAKOTO , TASHIRO KOREFUMI
IPC: B60L3/08 , B61L3/00 , B61L3/22 , B61L15/00 , G05B9/02 , G05B9/03 , G06F11/00 , G06F11/10 , G06F11/16 , G08C25/00
Abstract: The object of the present invention is to provide a controller and a system having a highly reliable fail safe function. An ATP device which generates control data for the two systems from an ATP command speed signal, duplicates the logic unit in the ATP device so as to process each control data, provides at least two CRC data for checking the control data for each system, and changes the CRC data of the opposite logic units or selects one of the two according to the content of a failure detection signal from each of the duplicated logic units. It is realized to check the control data and the operation of each logic circuit and only when all the data, circuits, and elements operate normally, an output signal for controlling the object to be controlled is outputted and when a failure is detected in a part, an output signal is outputted. Therefore, when a failure occurs, a fail safe function for controlling on the safety side is made possible.
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公开(公告)号:DE69233297T2
公开(公告)日:2004-11-18
申请号:DE69233297
申请日:1992-02-27
Applicant: HITACHI LTD
Inventor: KANEKAWA NOBUYASU , IHARA HIROKAZU , AKIYAMA MASATSUGU , KAWABATA KIYOSHI , YAMANAKA HISAYOSHI , OKISHIMA TETSUYA
IPC: G06F3/00 , G06F11/10 , G06F1/18 , G06F11/22 , G06F12/16 , G06F15/78 , G11C5/00 , H01L23/495 , H01L23/50 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18
Abstract: An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chips packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayer. The bus line includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate.
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