公开(公告)号：DE69128771T2

公开(公告)日：1998-08-20

申请号：DE69128771

申请日：1991-10-07

Applicant: HOLTRONIC TECHNOLOGIES LTD

Inventor： CLUBE FRANCIS S M

IPC: G03F1/08 ,  G03F9/00 ,  G03H1/00 ,  H01L21/027

Abstract: Apparatus for transverse position measurement in a proximity lithographic system including a prism (10) having a glass plate (14) index matched beneath the prism on which a T.I.R. hologram (13) is pre-recorded. A laser source (12) provides a replay beam. A silicon wafer (16) is situated below the hologram and parallel therewith. A second laser source (17) produces through optics (18) a beam with gaussian intensity profile to generate a collimated strip of light (19) at the hologram plane. Elemental grating structures (20) are provided at different locations over the surface of the wafer. Detectors (22,24) collect parts of the lightfield resulting from the interaction of the laser beam with the grating structures. A piezo device (26) operated from a micro-processor (28) moves the silicon wafer in small increments in a direction substantially parallel to the hologram following measurements made by the two detectors which are processed by the micro-processor to produce an alignment signal for the piezo device.

公开(公告)号：DE69128771D1

公开(公告)日：1998-02-26

申请号：DE69128771

申请日：1991-10-07

Applicant: HOLTRONIC TECHNOLOGIES LTD

Inventor： CLUBE FRANCIS S M

IPC: G03F1/08 ,  G03F9/00 ,  G03H1/00 ,  H01L21/027

Abstract: Apparatus for transverse position measurement in a proximity lithographic system including a prism (10) having a glass plate (14) index matched beneath the prism on which a T.I.R. hologram (13) is pre-recorded. A laser source (12) provides a replay beam. A silicon wafer (16) is situated below the hologram and parallel therewith. A second laser source (17) produces through optics (18) a beam with gaussian intensity profile to generate a collimated strip of light (19) at the hologram plane. Elemental grating structures (20) are provided at different locations over the surface of the wafer. Detectors (22,24) collect parts of the lightfield resulting from the interaction of the laser beam with the grating structures. A piezo device (26) operated from a micro-processor (28) moves the silicon wafer in small increments in a direction substantially parallel to the hologram following measurements made by the two detectors which are processed by the micro-processor to produce an alignment signal for the piezo device.