公开(公告)号：WO1996022515A1

公开(公告)日：1996-07-25

申请号：PCT/US1996000764

申请日：1996-01-19

Applicant: HONEYWELL INC.

Inventor： HONEYWELL INC. ,  WILDA, Douglas, W. ,  GLENN, Max, C.

IPC: G01L09/06

CPC classification number: G01L9/0054 ,  G01L19/0672

Abstract: A semiconductor pressure transducer comprises a silicon die having a topside and a bottom side. The silicon die further has a cavity in the bottom side thereby forming a diaphragm. Four piezoresistive elements are disposed on the topside of the silicon die on a periphery of the diaphragm and connected via metalized conductors disposed on the silicon die in the form of a Wheatstone bridge. A plurality of bonding pads disposed on the topside of the silicon die provides external access to the Wheatstone bridge circuit. A diagnostic conductor is disposed on the topside of the silicon die such that the periphery of the diaphragm is crossed, the diagnostic conductor being connected to corresponding bonding pads at each of the diagnostic conductor. Thus, when the diaphragm ruptures, the diagnostic conductor ruptures thereby providing a positive indication of the rupture of the diaphragm by external circuitry in which the diagnostic conductor is used.

Abstract translation: 半导体压力传感器包括具有顶侧和底侧的硅模具。 硅模具还在底侧具有空腔，从而形成隔膜。 四个压阻元件设置在隔膜的外周上的硅片的顶部，并通过以惠斯通电桥形式布置在硅芯片上的金属化导体连接。 设置在硅芯片顶部上的多个接合焊盘提供对惠斯登电桥电路的外部接入。 诊断导体设置在硅片的顶侧，使得隔膜的周边交叉，诊断导体连接到每个诊断导体上的对应的接合焊盘。 因此，当隔膜破裂时，诊断导体破裂，从而通过使用诊断导体的外部电路提供隔膜破裂的积极指示。

公开(公告)号：WO1997030356A1

公开(公告)日：1997-08-21

申请号：PCT/US1996001915

申请日：1996-02-15

Applicant: HONEYWELL INC.

Inventor： HONEYWELL INC. ,  WILDA, Douglas, W. ,  GLENN, Max, C.

IPC: G01P21/00

CPC classification number: G01P21/00

Abstract: A semiconductor sensor device measures a force being exerted thereon as a result of an acceleration of the semiconductor sensor device along a sensitive axis. The semiconductor sensor device comprises a flexure member having an outer plate (88) and an inner plate (68) separated from the outer plate by a groove (91) around the periphery of the inner plate, except by at least one hinge (69) for connecting the inner plate to the outer plate. The hinges are at predetermined locations around the periphery of the inner plate. Strain sensitive elements (81) are disposed on at least one of the hinges for providing an output signal deviation in accordance with the deviation of the inner plate as result of the force acting on the inner plate. A diagnostic conductor (45) is disposed on the semiconductor sensor device from a first predetermined point of the outer plate across the hinge to the inner plate and back across the hinge to a second predetermined point of the outer plate whereby the conductivity of the diagnostic conductor is measured between the first and second predetermined points of the outer plate to indicate a rupture of the hinge.

Abstract translation: 半导体传感器装置测量由于半导体传感器装置沿着敏感轴的加速而施加在其上的力。 半导体传感器装置包括具有外板（88）和内板（68）的挠曲构件，内板（68）除了至少一个铰链（69）之外，通过围绕内板周边的凹槽（91）与外板隔开， 用于将内板连接到外板。 铰链位于内板周围的预定位置处。 应变敏感元件（81）设置在至少一个铰链上，用于根据作用在内板上的力的内板的偏差提供输出信号偏差。 诊断导体（45）从外板的第一预定点穿过铰链设置到半导体传感器装置上，并穿过铰链回到外板的第二预定点，由此诊断导体 在外板的第一和第二预定点之间测量以指示铰链的破裂。

公开(公告)号：EP1012556A1

公开(公告)日：2000-06-28

申请号：EP98924764.8

申请日：1998-05-14

Applicant: Honeywell Inc.

Inventor： WILDA, Douglas, W. ,  DAVIDSON, James, V.

IPC: G01L19/06 ,  G01L19/00

CPC classification number: G01L19/0007

Abstract: A meter body (11) for use in a pressure transmitter in a continuous pressurized transmission system. The meter body is cylindrical in form with a bottom end (including a flexible diaphragm (11G)) adapted to engage a flexible gasket to form a so-called 'sanitary seal' connection. The top end is configured to be connected to a sensor capsule.

公开(公告)号：EP1012556B1

公开(公告)日：2006-01-11

申请号：EP98924764.8

申请日：1998-05-14

Applicant: HONEYWELL INC.

Inventor： WILDA, Douglas, W. ,  DAVIDSON, James, V.

IPC: G01L19/06 ,  G01L19/00

CPC classification number: G01L19/0007

Abstract: A meter body (11) for use in a pressure transmitter in a continuous pressurized transmission system. The meter body is cylindrical in form with a bottom end (including a flexible diaphragm (11G)) adapted to engage a flexible gasket to form a so-called "sanitary seal" connection. The top end is configured to be connected to a sensor capsule.