High temperature resonant integrated microstructure sensor
    2.
    发明公开
    High temperature resonant integrated microstructure sensor 有权
    输入谐振器Mikrostruktur-Sensorfürhohe温度

    公开(公告)号:EP1376087A1

    公开(公告)日:2004-01-02

    申请号:EP03077111.7

    申请日:1998-12-07

    Applicant: Honeywell Inc.

    CPC classification number: G01P15/097 G01L1/103 G01L1/186 G01L9/0011 G01L9/002

    Abstract: A very high temperature sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperature up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside, the very high temperature sensing environment and than using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.

    Abstract translation: 具有静电束驱动器和用于来自光束的感测光的光纤拾取器的谐振集成微结构的非常高的温度传感器。 高温传感器没有易受温度高达600摄氏度影响的组件。用于检测,处理和驱动的相关组件远离传感器环境。 通过在光束组件中使用不同的材料,例如用于光束的钨,以及用于衬底和壳体的蓝宝石,传感器可以承受高达1000摄氏度的温度。此外,光纤可用于处理电子器件之间的长距离连接 和传感器中的驱动器,通过将光电探测器定位在外部,非常高的温度感测环境以及使用光纤将长距离信号从处理器发送到驱动器光电检测器,以消除电信号到噪声问题 。

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