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公开(公告)号:WO2005034249A3
公开(公告)日:2005-09-09
申请号:PCT/US2004032652
申请日:2004-10-01
Applicant: HONEYWELL INT INC , WOOD ROLAND A , COLE BARRETT E , HIOASHI ROBERT E
Inventor: WOOD ROLAND A , COLE BARRETT E , HIOASHI ROBERT E
IPC: G01J5/20 , H01L27/146 , H01L31/09
CPC classification number: H01L27/14649 , G01J5/20
Abstract: A thermal sensor structure having one level for an infrared detecting pixel including the sensor associated electronics. The electronics displace a small area thereby having little effect on the fill area of the pixel relative to a level having no pixel electronics. That level has thermally isolation for the substrate through the limited structural attachment to the substrate because of the access vias to the silicon. It has additional isolation because of a pit of removed silicon from the substrate below that one level. The thermal sensor may have an array with a large number of pixels having the one level for the pixels and electronics structure.
Abstract translation: 具有用于包括传感器相关电子器件的红外检测像素的一个电平的热传感器结构。 电子设备取代了小面积,因此相对于没有像素电子器件的水平面对像素的填充面积几乎没有影响。 由于通向硅的通路,该层通过有限的结构附着到衬底而对衬底具有热隔离。 它具有额外的隔离功能,因为从一层以下的衬底上去除了硅的坑。 热传感器可以具有具有用于像素和电子结构的具有一个电平的大量像素的阵列。
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公开(公告)号:CA2534190A1
公开(公告)日:2005-04-14
申请号:CA2534190
申请日:2004-10-01
Applicant: HONEYWELL INT INC
Inventor: HIOASHI ROBERT E , WOOD ROLAND A , COLE BARRETT E
IPC: H01L31/09 , G01J5/20 , H01L27/146
Abstract: A thermal sensor structure having one level for an infrared detecting pixel including the sensor associated electronics. The electronics displace a smal l area thereby having little effect on the fill area of the pixel relative to a level having no pixel electronics. That level has thermally isolation for th e substrate through the limited structural attachment to the substrate because of the access vias to the silicon. It has additional isolation because of a pit of removed silicon from the substrate below that one level. The thermal sensor may have an array with a large number of pixels having the one level for the pixels and electronics structure.
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