Abstract:
Disclosed herein is a method of forming an alloy material for use in a wire. The method includes forming a master alloy containing lead and silver; and creating a molten wire alloy by combining the master alloy, additional lead, and a third material in a vessel. The method also includes flowing argon gas through and over the molten wire alloy. The method also includes drawing the molten alloy from the vessel through an actively cooled die, and solidifying the molten wire alloy to form a bar of wire alloy.
Abstract:
A method of purifying and casting a material comprising placing a material to be purified within a crucible, the crucible located within a purification chamber; providing thermal energy to the material to maintain the material in a molten state; providing a purification gas into the molten material to purify the material until a first measured condition is attained; passing the material in a fluid state from the purification chamber having a first atmosphere to a casting chamber having a second atmosphere, the purification chamber in fluid communication with the casting chamber such that the material passes from the purification chamber to the casting chamber without exposure to a third atmosphere; placing the material into a mold within the casting chamber; cooling the material within the mold to form a cast material.
Abstract:
A method of purifying and casting a material comprising placing a material to be purified within a crucible, the crucible located within a purification chamber; providing thermal energy to the material to maintain the material in a molten state; providing a purification gas into the molten material to purify the material until a first measured condition is attained; passing the material in a fluid state from the purification chamber having a first atmosphere to a casting chamber having a second atmosphere, the purification chamber in fluid communication with the casting chamber such that the material passes from the purification chamber to the casting chamber without exposure to a third atmosphere; placing the material into a mold within the casting chamber; cooling the material within the mold to form a cast material.
Abstract:
Electronic packaging arrangements having lead-free solders are disclosed. In particular, lead-free solder compositions and lead frame constructs for use therewith are disclosed. The lead-free solder compositions may be zinc-based and may include zinc, aluminum, and germanium as major components and gallium and magnesium as minor components. The lead-free, zinc-based solder compositions may exhibit desirable melting properties, mechanical properties, and wetting properties, for example.