公开(公告)号：US10527927B2

公开(公告)日：2020-01-07

申请号：US16235334

申请日：2018-12-28

Applicant: HOYA CORPORATION

Inventor： Kazuhiro Hamamoto ,  Yoichi Usui

IPC: G03F1/24 ,  G03F1/38 ,  B32B7/02 ,  G03F7/20

Abstract: A conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 μm×1 μm of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70−BA30)/(BD70−BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.

公开(公告)号：US20190155141A1

公开(公告)日：2019-05-23

申请号：US16235334

申请日：2018-12-28

Applicant: HOYA CORPORATION

Inventor： Kazuhiro HAMAMOTO ,  Yoichi Usui

IPC: G03F1/24 ,  G03F1/38 ,  G03F7/20 ,  B32B7/02

CPC classification number: G03F1/24 ,  B32B7/02 ,  B32B2307/416 ,  B32B2551/00 ,  G03F1/38 ,  G03F7/20

Abstract: A conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 μm×1 μm of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70−BA30)/(BD70−BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.

公开(公告)号：US10209614B2

公开(公告)日：2019-02-19

申请号：US15655932

申请日：2017-07-21

Applicant: HOYA CORPORATION

Inventor： Kazuhiro Hamamoto ,  Yoichi Usui

IPC: B32B7/02 ,  G03F1/24 ,  G03F1/38 ,  G03F7/20

Abstract: A conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 μm×1 μm of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70-BA30)/(BD70-BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.

公开(公告)号：US09746762B2

公开(公告)日：2017-08-29

申请号：US14896411

申请日：2014-09-22

Applicant: HOYA CORPORATION

Inventor： Kazuhiro Hamamoto ,  Yoichi Usui

IPC: G03F1/24 ,  G03F1/22 ,  G03F1/60 ,  B32B7/02 ,  G03F7/20 ,  G03F1/38

CPC classification number: G03F1/24 ,  B32B7/02 ,  B32B2307/416 ,  B32B2551/00 ,  G03F1/38 ,  G03F7/20

Abstract: Provided is a conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 μm×1 μm of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70−BA30)/(BD70−BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.