公开(公告)号：WO03043200A2

公开(公告)日：2003-05-22

申请号：PCT/US0236848

申请日：2002-11-15

Applicant: HRL LAB LLC ,  YAP DANIEL ,  JENSEN JOSEPH F

Inventor： YAP DANIEL ,  JENSEN JOSEPH F

IPC: H03M3/02 ,  H03M3/00

CPC classification number: H03M3/47 ,  G02F7/00 ,  H03M3/43 ,  H03M3/456

Abstract: A Delta-Sigma Analog-to-Digital Converter (ADC) that can have a very high sampling rate (over 100 GHz) and which is preferably optically sampled to help achieve its very high sampling rate. The sampling rate can be many times higher than the regeneration speed of the electronic quantizers used in the ADC.

Abstract translation: Delta-Sigma模数转换器（ADC），其可以具有非常高的采样率（超过100GHz），并且其优选地被光学采样以帮助实现其非常高的采样率。 采样率可以比ADC中使用的电子量化器的再生速度高出许多倍。

公开(公告)号：WO0167494A3

公开(公告)日：2002-04-04

申请号：PCT/US0102100

申请日：2001-01-23

Applicant: HRL LAB LLC ,  YAP DANIEL ,  LAWYER PHILLIP H

Inventor： YAP DANIEL ,  LAWYER PHILLIP H

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/34

CPC classification number: H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/13007 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/1423 ,  H01L2924/19042 ,  H05K3/3473 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: A solder bump structure and a method for fabrication of a solder bump, comprising applying preferably an insulating film, followed by applying a multilayer underbump metallization, a layer of a photoresist, and a thin layer of titanium or chrome, or Ti-Ni-Ti, Ti-Ni-Cr, Ti-Pt-Ti, or Ti-Ni-SiOX deposited over or under said underbump metallization, on a substrate containing, preferably, III-V semiconductor circuits and removing said thin layer in a region spaced from said underbump metallization.

Abstract translation: 一种焊料凸块结构和焊料凸块的制造方法，其特征在于，优选采用绝缘膜，然后施加多层下凹金属化，光致抗蚀剂层和钛或铬的薄层，或Ti-Ni-Ti ，在包含优选III-V族半导体电路的基板上沉积的所述底部金属化之上或之下的Ti-Ni-Cr，Ti-Pt-Ti或Ti-Ni-SiOX，并且在与所述 底部金属化。

公开(公告)号：AU2003293040A1

公开(公告)日：2004-06-18

申请号：AU2003293040

申请日：2003-11-20

Applicant: HRL LAB LLC

Inventor： PEPPER DAVID M ,  DUNNING GILMORE J ,  YAP DANIEL

IPC: H04B10/145 ,  H04B10/155

公开(公告)号：AU2003290975A1

公开(公告)日：2004-06-15

申请号：AU2003290975

申请日：2003-11-13

Applicant: HRL LAB LLC

Inventor： MANGIR METIN S ,  YAP DANIEL ,  NG WILLIE W

IPC: G01S7/292 ,  G02B6/26 ,  H04B10/18 ,  H04B10/12 ,  H01S3/30

Abstract: A limiter for limiting selected frequency components by generating Stokes waves in a stimulated Brillouin scattering medium. The generated Stokes waves create a seed that is provided to another stimulated Brillouin scattering medium. The seed selecting the undesired frequency components to be attenuated.

公开(公告)号：AU2002363750A1

公开(公告)日：2003-05-26

申请号：AU2002363750

申请日：2002-11-15

Applicant: HRL LAB LLC

Inventor： SAYYAH KEYVAN ,  YAP DANIEL

IPC: G02B6/28 ,  G02F1/00 ,  H04B10/12 ,  H04B10/155 ,  H03K4/02 ,  G06F1/00

Abstract: A waveform synthesizer comprising for synthesizing RF lightwave waveforms in the optical domain. These waveforms are constructed by generating their constituent Fourier frequency components or tones and then adjusting the amplitudes of those frequency components or tones. The apparatus includes: a RF-lightwave frequency-comb generator; and a multi-tone, frequency selective amplitude modulator coupled to the RF-lightwave frequency-comb generator for generating a continuous-wave comb comprising a set of RF tones amplitude modulated onto a lightwave carrier.

公开(公告)号：AU8827201A

公开(公告)日：2002-03-13

申请号：AU8827201

申请日：2001-08-16

Applicant: HRL LAB LLC ,  HUGHES ELECTRONICS CORP

Inventor： YAP DANIEL ,  YUNG MICHAEL

IPC: G02B6/42 ,  H01L31/0232 ,  H01S5/02 ,  H01S5/022 ,  H01S5/183 ,  G02B7/24

Abstract: Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.

公开(公告)号：GB2401988A

公开(公告)日：2004-11-24

申请号：GB0323586

申请日：2002-03-21

Applicant: HRL LAB LLC

Inventor： HSU TSUNG-YUAN ,  NG WILLIE ,  YAP DANIEL

IPC: G02F1/01 ,  H01S3/083 ,  H01S3/098 ,  H01S5/10 ,  H01S5/12 ,  H01S5/14

Abstract: A laser system and method for self-injection locking. The system includes a laser (10) having a laser output at a frequency wo. An optical port (14) provides a portion of the laser output at the port and a modulator (16), coupled to the port, is driven by a RF signal at a frequency wm generates two sidebands at wo Ò wm. A filter (18) passes one of the two sidebands; and an optical path (20) couples an output of the filter to the laser for injection locking.

公开(公告)号：AU4142501A

公开(公告)日：2001-09-17

申请号：AU4142501

申请日：2001-01-23

Applicant: HRL LAB LLC

Inventor： YAP DANIEL ,  LAWYER PHILLIP H

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L21/00

Abstract: A solder bump structure for use on a substrate. The solder bump structure includes a multilayer underbump metallization having a major upper surface with a solder wetable caplayer for contacting a solder bump, the mutilayer underbump metallization projecting from the substrate with an exposed sidewall; a thin layer of a metal selected from a group consisting of titanium, chrome, a titanium-nickel-titanium composite, a titanium-nickel-chrome composite, a titanium-platinum-titanium alloy, and a titanium-nickel-oxidized silicon composite deposited over or under the multilayer underbump metallization and covering the exposed sidewall of the multilayer underbump metallization.

公开(公告)号：AU2003293040A8

公开(公告)日：2004-06-18

申请号：AU2003293040

申请日：2003-11-20

Applicant: HRL LAB LLC

Inventor： PEPPER DAVID M ,  DUNNING GILMORE J ,  YAP DANIEL

IPC: H04B10/145 ,  H01S3/23

公开(公告)号：AU2003226320A1

公开(公告)日：2003-11-03

申请号：AU2003226320

申请日：2003-04-08

Applicant: HRL LAB LLC

Inventor： YAP DANIEL ,  SO YIU-MAN

IPC: H01S3/00 ,  H01S5/062 ,  H01S5/12 ,  H01S5/40 ,  H04B10/148