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1.发明申请
公开(公告)号：WO1987003773A1
公开(公告)日：1987-06-18
申请号：PCT/US1986001967
申请日：1986-09-22
Applicant: HUGHES AIRCRAFT COMPANY
Inventor： HUGHES AIRCRAFT COMPANY , LEYDEN, Richard, N. , LAWRENCE, Robert
IPC: H05K03/00
CPC classification number: C09K13/00 , H05K1/0346 , H05K1/0393 , H05K3/002 , H05K3/386 , H05K2201/0154 , H05K2203/0554
Abstract: Methods for forming holes of predetermined size in polyimide substrates having metallic layers adhesively attached thereto include selectively removing areas of desired size and shape from the metallic layer; contacting the exposed adhesive layer with a selective etchant therefor that does not affect the polyimide substrate or undercut the adhesive near the opening formed; and selectively etching the polyimide substrate exposed in the openings by removal of the adhesive layer overlying the polyimides. These methods permit rapid, efficient formation of holes having a diameter as small as one mil (0.00254 cm).
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Patent Agency Ranking
公开(公告)号：WO1988005990A1
公开(公告)日：1988-08-11
申请号：PCT/US1988000116
申请日：1988-01-19
Applicant: HUGHES AIRCRAFT COMPANY
Inventor： HUGHES AIRCRAFT COMPANY , LAWRENCE, Robert , LEYDEN, Richard, N.
IPC: H05K03/10
Abstract: A method for forming a circuit on a surface of an insulating substrate (10) comprises the steps of adhering Angstroms thick metallization (16) to the surface of the insulating substrate, placing conductive material (24) on the metallization through a photoresist pattern (20) of the circuit, stripping the resist pattern from the substrate, and removing the metallization not covered by the circuit of the conductive material by use of the conductive material as a resist.
Abstract translation: 一种用于在绝缘衬底（10）的表面上形成电路的方法包括以下步骤：将厚度厚的金属化物（16）粘合到绝缘衬底的表面上，通过光致抗蚀剂图案（20）将导电材料（24）放置在金属化 ），从衬底剥离抗蚀剂图案，并且通过使用导电材料作为抗蚀剂去除未被导电材料的电路覆盖的金属化。
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公开(公告)号：WO1988005217A1
公开(公告)日：1988-07-14
申请号：PCT/US1987002951
申请日：1987-11-13
Applicant: HUGHES AIRCRAFT COMPANY
Inventor： HUGHES AIRCRAFT COMPANY , LAWRENCE, Robert , PATEL, Ashok, B.
IPC: H01R09/07
CPC classification number: H01R12/79 , H01R12/774 , H01R13/22 , H05K3/365
Abstract: A flex harness (20) and a printed wiring board are provided (18) with a plurality of bumps (66) on each line (62) so that, upon mating between the flex harness and the printed wiring board, the bumps provide redundant connections therebetween.
Abstract translation: 柔性线束（20）和印刷线路板（18）在每条线（62）上设置有多个凸起（66），使得在柔性线束和印刷线路板之间配合时，凸块提供冗余连接 其间。
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公开(公告)号：EP0294479A1
公开(公告)日：1988-12-14
申请号：EP88902070.0
申请日：1987-11-13
Applicant: HUGHES AIRCRAFT COMPANY
Inventor： LAWRENCE, Robert , PATEL, Ashok, B.
CPC classification number: H01R12/79 , H01R12/774 , H01R13/22 , H05K3/365
Abstract: Un faisceau de câbles souple (20) et une carte de câblage imprimée (18) présentent plusieurs protubérances (66) placées sur chaque ligne (62) de sorte que, lors de l'appariage entre le faisceau de câbles souple et la carte de câblage imprimée, les protubérances assurent des connexions redondantes entre eux.
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公开(公告)号：EP0248029B1
公开(公告)日：1992-03-04
申请号：EP86906129.1
申请日：1986-09-22
Applicant: Hughes Aircraft Company
Inventor： LEYDEN, Richard, N. , LAWRENCE, Robert
CPC classification number: C09K13/00 , H05K1/0346 , H05K1/0393 , H05K3/002 , H05K3/386 , H05K2201/0154 , H05K2203/0554
Abstract: Methods for forming holes of predetermined size in polyimide substrates having metallic layers adhesively attached thereto include selectively removing areas of desired size and shape from the metallic layer; contacting the exposed adhesive layer with a selective etchant therefor that does not affect the polyimide substrate or undercut the adhesive near the opening formed; and selectively etching the polyimide substrate exposed in the openings by removal of the adhesive layer overlying the polyimides. These methods permit rapid, efficient formation of holes having a diameter as small as one mil (0.00254 cm).
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6.发明公开METHOD FOR SELECTIVELY REMOVING ADHESIVES FROM POLYIMIDE SUBSTRATES 失效过程，以POLYIMIDTRÄGERPLATTEN黏结剂选择性去除。
公开(公告)号：EP0248029A1
公开(公告)日：1987-12-09
申请号：EP86906129.0
申请日：1986-09-22
Applicant: Hughes Aircraft Company
Inventor： LEYDEN, Richard, N. , LAWRENCE, Robert
CPC classification number: C09K13/00 , H05K1/0346 , H05K1/0393 , H05K3/002 , H05K3/386 , H05K2201/0154 , H05K2203/0554
Abstract: Procédés de formation de trous de taille prédéterminée dans des substrats à base de polyimide sur lesquels adhèrent des couches métalliques. Les procédés consistent à éliminer sélectivement de la couche métallique des zones de taille et de forme désirées; à mettre en contact la couche adhésive exposée avec un décapant sélectif qui n'affecte pas le substrat à base de polyimide ou qui n'affaiblit pas l'adhésif à proximité de l'ouverture formée; et à attaquer de manière sélective le substrat à base de polyimide exposé dans les ouvertures par l'élimination de la couche adhésive recouvrant le polyimide. Ces procédés permettent de former de manière rapide et efficiente des trous possédant un diamètre aussi petit qu'un mil (0,00254 cm).
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