DIODE DEVICE PACKAGING ARRANGEMENT
    1.
    发明申请
    DIODE DEVICE PACKAGING ARRANGEMENT 审中-公开
    二极管封装装置

    公开(公告)号:WO1989010006A1

    公开(公告)日:1989-10-19

    申请号:PCT/US1989000858

    申请日:1989-03-06

    CPC classification number: H01P1/005

    Abstract: An arrangement for packaging an active millimeter wave device is provided having an active solid state diode (18) mounted on a cylindrical shaped heat sink pedestal (12). The cap (24) for the diode is an elongated cylindrical conductor which also serves as a portion of the center coaxial conductor and DC bias pin. A conductive annular ring (28) is also mounted on the pedestal encircling the diode and serves as the outer coaxial conductor for the coaxial transmission line structure. Advantageously the coaxial transmission line, namely the center and outer conductors, can be precisely assembled in relation to the diode for improved impedance characteristic and efficient energy coupling. Furthermore, the elongated cap (24) moves the point of contact with the bias pin (36) to a region of higher RF impedance, reducing RF losses.

    DIODE DEVICE PACKAGING ARRANGEMENT
    2.
    发明公开
    DIODE DEVICE PACKAGING ARRANGEMENT 失效
    PACKAGE SYSTEM FOR二极管排列。

    公开(公告)号:EP0394375A1

    公开(公告)日:1990-10-31

    申请号:EP89904947.0

    申请日:1989-03-06

    IPC: H01P1

    CPC classification number: H01P1/005

    Abstract: Un agencement pour mise sous boîtier d'un dispositif à ondes millimétriques actives comporte une diode (18) monolithique active montée sur un support cylindrique (12) faisant office de puits thermique. Le chapeau (24) de la diode est un conducteur cylindrique allongé qui constitue également une partie du conducteur coaxial central et de la broche de polarisation cc . Une bague annulaire conductrice (28) est également montée sur le support encerclant la diode et fait office de conducteur coaxial extérieur pour la structure de la ligne coaxiale de transport d'énergie. Avantageusement, cette ligne coaxiale de transport d'énergie, à savoir les conducteurs central et extérieur, peut être assemblée avec précision par rapport à la diode afin de permettre une impédance améliorée et un couplage énergétique efficace. D'autre part, le chapeau allongé (24) déplace le point de contact avec la broche de polarisation (36) vers une région d'impédance HF plus élevée, ce qui réduit les pertes HF .

    DIODE DEVICE PACKAGING ARRANGEMENT
    3.
    发明授权
    DIODE DEVICE PACKAGING ARRANGEMENT 失效
    二极管装置包装装置

    公开(公告)号:EP0394375B1

    公开(公告)日:1993-02-17

    申请号:EP89904947.2

    申请日:1989-03-06

    CPC classification number: H01P1/005

    Abstract: An arrangement for packaging an active millimeter wave device is provided having an active solid state diode (18) mounted on a cylindrical shaped heat sink pedestal (12). The cap (24) for the diode is an elongated cylindrical conductor which also serves as a portion of the center coaxial conductor and DC bias pin. A conductive annular ring (28) is also mounted on the pedestal encircling the diode and serves as the outer coaxial conductor for the coaxial transmission line structure. Advantageously the coaxial transmission line, namely the center and outer conductors, can be precisely assembled in relation to the diode for improved impedance characteristic and efficient energy coupling. Furthermore, the elongated cap (24) moves the point of contact with the bias pin (36) to a region of higher RF impedance, reducing RF losses.

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