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公开(公告)号：WO2015009237A1
公开(公告)日：2015-01-22
申请号：PCT/SG2014/000334
申请日：2014-07-16
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： ALASIRNIO, Jukka , RUDMANN, Hartmut , CESANA, Mario , HEIMGARTNER, Stephan
CPC classification number: G02B7/021 , G02B3/00 , G02B7/02 , G03B17/02 , G03B29/00 , H04N5/225 , H04N5/2254 , H04N5/2257
Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.
Abstract translation: 相机模块包括透镜，透镜组和/或透镜阵列。 一个或多个透镜具有非圆形形状，这在一些情况下可以在模块的尺寸上提供更大的灵活性并且可以导致非常小的相机模块。
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公开(公告)号：WO2015038064A3
公开(公告)日：2015-03-19
申请号：PCT/SG2014/000390
申请日：2014-08-20
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： GUBSER, Simon , CESANA, Mario , ROSSI, Markus , RUDMANN, Hartmut
IPC: H01L31/00
Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
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3.发明申请
公开(公告)号：WO2014168586A1
公开(公告)日：2014-10-16
申请号：PCT/SG2014/000159
申请日：2014-04-11
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： ROSSI, Markus , RUDMANN, Hartmut , CESANA, Mario
CPC classification number: G02B3/0068 , G02B7/021 , G02B7/028
Abstract: Various features can be provided to help reduce or alleviate the effects of thermal expansion/contraction of a lens array material. Such features include stress release cuts in the surface(s) of the lens array, a frame having a low constant of thermal expansion (CTE) embedded within the lens array, or polymer fibers wrapped around the lens array or around the lens array housing. The features can be used alone or in conjunction with one or more of the other features for reducing or alleviating the effects of the thermal expansion/contraction. In addition, one or more parts of a housing for the lens array can be composed of a material having a relatively low CTE. The lens array package can be incorporated into a camera or other image capturing device.
Abstract translation: 可以提供各种特征以帮助减少或减轻透镜阵列材料的热膨胀/收缩的影响。 这些特征包括透镜阵列的表面中的应力释放切口，嵌入在透镜阵列内的低常数的热膨胀（CTE）的框架，或缠绕在透镜阵列周围或围绕透镜阵列壳体的聚合物纤维。 特征可以单独使用或与一个或多个其它特征结合使用，以减少或减轻热膨胀/收缩的影响。 此外，用于透镜阵列的壳体的一个或多个部分可以由具有相对较低CTE的材料构成。 透镜阵列封装可以并入相机或其他图像捕获装置中。
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4.发明申请OPTO-ELECTRONIC MODULES INCLUDING ELECTRICALLY CONDUCTIVE CONNECTIONS FOR INTEGRATION WITH AN ELECTRONIC DEVICE 审中-公开OPTO-ELECTRONIC模块，包括用于与电子设备集成的电气连接
公开(公告)号：WO2014070107A1
公开(公告)日：2014-05-08
申请号：PCT/SG2013/000459
申请日：2013-10-31
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： RUDMANN, Hartmut , CESANA, Mario , ALASIRNIO, Jukka , BOUCHILLOUX, Philippe , WESTENHÖFER, Susanne , GEIGER, Jens
IPC: G02B6/12
CPC classification number: H05K3/4697 , H01L23/49833 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L31/0203 , H01L2224/04026 , H01L2224/24227 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/83192 , H01L2224/83851 , H01L2224/97 , H01L2924/12041 , H01L2924/12043 , H01L2924/12044 , H01L2924/15153 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H05K1/182 , H05K1/183 , H05K2201/10121 , H05K2203/063 , H01L2224/83 , H01L2924/00
Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.
Abstract translation: 光电模块包括导电布线和连接，可以方便将模块集成到外部设备中。 一些光电模块包括包括至少一个透镜和光电元件的光电堆叠。 导电路径可以从模块的底部延伸到顶部。 导电路径可以包括在光电子元件的表面上的导电焊盘，以及至少部分地嵌入基板的布线和用于光电叠层的壳体的壁。 导电连接可以设置在基板的顶表面和壁的底表面之间，使得导电连接将第二布线电连接到第一布线和光电元件表面上的导电垫。 模块可以例如在晶片级处理中制造，从而可以同时制造多个光电模块。
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5.发明申请OPTOELECTRONIC MODULES HAVING A SILICON SUBSTRATE, AND FABRICATION METHODS FOR SUCH MODULES 审中-公开具有硅基板的光电模块，以及用于这种模块的制造方法
公开(公告)号：WO2016028227A1
公开(公告)日：2016-02-25
申请号：PCT/SG2015/050264
申请日：2015-08-18
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： RUDMANN, Hartmut , CESANA, Mario , GEIGER, Jens , ROENTGEN, Peter , CONDORELLI, Vincenzo
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/14621 , H01L27/14685
Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
Abstract translation: 光电模块包括硅衬底，其中或在其上具有光电子器件。 光学组件设置在光电子器件上方，并且间隔件将硅衬底与光学组件分离。 还描述了制造这种模块的方法。
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Patent Agency Ranking6.发明申请TRANSCEIVER MODULE INCLUDING OPTICAL SENSOR AT A ROTATIONALLY SYMMETRIC POSITION 审中-公开收发器模块，包括旋转对称位置的光传感器
公开(公告)号：WO2016028226A1
公开(公告)日：2016-02-25
申请号：PCT/SG2015/050263
申请日：2015-08-18
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： HALLAL, Bassam , RUDMANN, Hartmut , CESANA, Mario , EBENTHEUER, Nicole
CPC classification number: H04B10/40 , G02B19/0009 , H01S5/02288 , H01S5/183 , H01S2301/18 , H04B10/1123 , H04B10/1143 , H04B10/80 , H04L5/16 , H04M1/737
Abstract: An optoelectronic module includes a transceiver operable to transmit data optically. The transceiver includes a light emitter to emit light from the module, and a light detector to detect light entering the module. The light detector is disposed at a rotationally symmetric position with respect to a central axis of the module. Such modules can help facilitate the exchange of data optically between two devices.
Abstract translation: 光电子模块包括可操作以光学地传输数据的收发器。 收发器包括用于从模块发射光的光发射器，以及用于检测进入模块的光的光检测器。 光检测器相对于模块的中心轴设置在旋转对称位置。 这样的模块可以有助于在两个设备之间光学交换数据。
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7.发明申请IMAGE SENSOR MODULES INCLUDING PRIMARY HIGH-RESOLUTION IMAGERS AND SECONDARY IMAGERS 审中-公开图像传感器模块，包括主要的高分辨率图像和二次成像
公开(公告)号：WO2015130226A1
公开(公告)日：2015-09-03
申请号：PCT/SG2015/000051
申请日：2015-02-23
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： ALASIRNIÖ, Jukka , SENN, Tobias , MEITAV, Ohad , DORON, Moshe , YASAN, Alireza , CESANA, Mario , CUTU, Florin , RUDMANN, Hartmut , ROSSI, Markus , ROENTGEN, Peter , CALERO, Daniel PéREZ , HALLAL, Bassam , GEIGER, Jens
IPC: G03B37/04 , G03B19/00 , H01L27/146
CPC classification number: H04N5/247 , G02B13/0085 , G03B15/05 , G03B17/12 , G03B35/08 , G03B37/04 , H04N5/2253 , H04N5/2256 , H04N5/332
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
Abstract translation: 图像传感器模块包括主要的高分辨率成像器和二次成像器。 例如，图像传感器模块可以包括半导体芯片，其包括分别定义主相机和次相机的光敏区域。 图像传感器模块可以包括基本上不妨碍次要照相机的视场的光学组件。 一些模块包括多个辅助摄像机，其具有至少与主摄像机的视场相同的视场。 描述了各种特征以便于获取可用于计算深度信息的信号。
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8.发明申请OPTICAL MODULES INCLUDING FOCAL LENGTH ADJUSTMENT AND FABRICATION OF THE OPTICAL MODULES 审中-公开光学模块包括光学模块的焦距长度调整和制造
公开(公告)号：WO2014070115A1
公开(公告)日：2014-05-08
申请号：PCT/SG2013/000470
申请日：2013-10-31
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： HEIMGARTNER, Stephan , KETTUNEN, Ville , SPRING, Nicola , BIETSCH, Alexander , CESANA, Mario , RUDMANN, Hartmut , ALASIRNIO, Jukka , LENART, Robert
IPC: G02B13/00 , G02B7/02 , H01L31/0232 , H04N5/225
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。
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9.发明申请OPTOELECTRONIC MODULE HAVING DUAL ENCAPSULATION WITH OPENING FOR RECEIVING AN OPTICAL ASSEMBLY 审中-公开具有双重封装的光电子模块，用于接收光学组件
公开(公告)号：WO2017142487A1
公开(公告)日：2017-08-24
申请号：PCT/SG2017/050076
申请日：2017-02-17
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： CAMARRI, Camilla , CESANA, Mario , RUDMANN, Hartmut
CPC classification number: G01S7/4814 , G01S7/4813 , G01S7/4816 , G02B3/00 , H01L25/047 , H01L25/16 , H01L25/165 , H01L25/167 , H01L31/00 , H01L31/0203 , H01L31/12 , H01L51/44
Abstract: An optoelectronic module includes first and second optical channels having respective active optoelectronic components. A transparent encapsulation is over the active optoelectronic components, and opaque encapsulation is on the transparent encapsulation. The opaque encapsulation has a first opening over a first active optoelectronic component and a second opening over a second optoelectronic component. The opaque encapsulation forms a ledge in an area of the second opening, and an optical assembly is disposed on the ledge within the second opening over the second optoelectronic component.
Abstract translation: 光电子模块包括具有相应有源光电子部件的第一和第二光通道。 透明封装位于有源光电子器件上方，不透明封装位于透明封装上。 不透明封装具有第一有源光电子部件上的第一开口和第二光电子部件上的第二开口。 不透明封装在第二开口的区域中形成凸缘，并且光学组件布置在第二光电子部件上的第二开口内的凸缘上。
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10.发明申请OPTOELECTRONIC MODULES OPERABLE TO DISTINGUISH BETWEEN SIGNALS INDICATIVE OF REFLECTIONS FROM AN OBJECT OF INTEREST AND SIGNALS INDICATIVE OF A SPURIOUS REFLECTION 审中-公开光电子模块可用于表示从兴趣对象和信号反映的反射信号之间的差异表示反射性
公开(公告)号：WO2016010481A1
公开(公告)日：2016-01-21
申请号：PCT/SG2015/050211
申请日：2015-07-13
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： ALASIRNIÖ, Jukka , SENN, Tobias , CESANA, Mario , RUDMANN, Hartmut , ROSSI, Markus , ROENTGEN, Peter , CALERO, Daniel Pérez , HALLAL, Bassam , GEIGER, Jens
CPC classification number: A61B5/14551 , A61B5/02416 , A61B5/02433 , A61B5/14552 , G01J1/4204 , G01S7/497 , G01S17/48 , G01S2007/4975
Abstract: The present disclosure describes modules operable to perform optical sensing. The module can be operable to distinguish between signals indicative of reflections from an object or interest and signals indicative of a spurious reflection such as from a smudge (i.e., a blurred or smeared mark) on the host device's cover glass. Signals assigned to reflections from the object of interest can be used to for various purposes, depending on the application (e.g., determining an object's proximity, a person's heart rate or a person's blood oxygen level).
Abstract translation: 本公开描述了可操作以执行光学感测的模块。 该模块可操作以区分表示来自物体或感兴趣的反射的信号和指示诸如从主机设备的盖玻片上的污迹（即，模糊或模糊标记）的假反射的信号。 根据应用（例如，确定对象的接近度，人的心率或人的血氧水平），分配给来自感兴趣对象的反射的信号可用于各种目的。
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