Abstract:
The method for manufacturing a multitude of devices comprises: - providing a replication tool comprising a tool material; - conditioning the replication tool, wherein the conditioning comprises applying a treatment to the tool material, wherein the treatment comprises exposing the tool material to a conditioning material. And it further comprises, after the conditioning: - carrying out one or more replication processes, wherein in each of the one or more replication processes, one or more of the devices are produced from a replication material by replication using the replication tool. The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.
Abstract:
Optoelectronic modules, such as proximity sensors, two-dimensional and three- dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.
Abstract:
The method for manufacturing optical light guide elements comprises a) providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; b) positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; c) fixing the plurality of initial bars with respect to each other in the position achieved in step b) to obtain a bar arrangement. The method further comprises at least one of the following steps d), d'), d''): d) segmenting the bar arrangement into bars referred to as prism bars each of which comprises a portion of at least two different ones of the plurality of initial bars, by conducting a plurality of cuts through the bar arrangement; in particular wherein the cuts are parallel cuts; d') segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into parts along cut lines, wherein the cut lines are at an angle with the initial-bar directions; d'') segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into sections by creating cut faces which are at an angle with respect to the initial-bar directions. And the method further comprises e) segmenting the prism bars into parts.
Abstract:
The present disclosure describes optoelectronic modules (e.g., hybrid lens array packages) that have multiple optical channels, each of which includes at least one beam shaping element (e.g., a lens) that is part of a laterally contiguous array. Each optical channel is associated with a respective light sensitive region of an image sensor. Some or all of the channels also can include at least one beam shaping element (e.g., a lens) that is not part of a laterally contiguous array. In some cases, the arrays can include alignment features to facilitate alignment of the arrays with one another.
Abstract:
An optoelectronic module includes a cover substrate including a passive optical element, a base substrate including an optoelectronic device, and a spacer layer joining the cover substrate to the base substrate. The spacer layer includes multiple first spacer elements fixed to a surface of the cover substrate and multiple second spacer elements fixed to a surface of the base substrate, in which each first spacer element is joined to a corresponding second spacer element through an adhesive layer, and in which the cover substrate, base substrate, and spacer layer define an interior region of the module in which the optical element is aligned with the optoelectronic device.
Abstract:
Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
Abstract:
The spectrometer module (1) comprises - a first member (O) having a first face (F1) which is substantially planar, wherein directions perpendicular to said first face are referred to as vertical directions; - a second member (P) having a second face (F2) facing said first face (F1), which is substantially planar and is aligned substantially parallel to said first face; - a third member (S) comprised in said first member or comprised in said second member or distinct from and located between these, which comprises an opening (4); - a dispersive element (G); and - a preferably position-sensitive light sensor (25); wherein said first member (O) comprises one or more transparent portions (t) through which light can pass. Usually, a maximum vertical extension of the module (1) is at most 12 mm and a maximum lateral extension of the module is at most 20 mm. Such modules (1) can be manufactured in high quality on wafer level.
Abstract:
The opto-electronic module (1) comprises - a first substrate member (P); - a third substrate member (B); - a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a';5b;5b'); - a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); - a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); - a light detecting element (D) arranged on and electrically connected to said first substrate member (P); - a light emission element (E) arranged on and electrically connected to said first substrate member (P); and - a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.
Abstract:
The optical module (1) comprises — a first member (O) having a first face (Fl) which is substantially planar, wherein directions perpendicular to said first face (Fl) are referred to as vertical directions; — a second member (P) having a second face (F2) facing said first face (Fl), which is substantially planar and is aligned substantially parallel to said first face (Fl); — a third member (S) comprised in said first member (O) or comprised in said second member (P) or distinct from and located between these, which comprises an opening (4); and — a diffraction grating (G); wherein said first member (O) comprises one or more transparent portions through which light can pass. It is possible to manufacture said diffraction grating (G) in one process together with said first (O) or said second (P) member. The whole module can be manufactured on wafer-level.
Abstract:
The optical module (1) comprises - a first member (O) having a first face which is substantially planar, wherein directions perpendicular to said first face are referred to as vertical directions (z) and directions perpendicular to a vertical direction are referred to as lateral directions (x,y); - a second member (P) having a second face facing said first face, which is substantially planar and is aligned substantially parallel to said first face; - a third member (S) comprised in said first member (O) or comprised in said second member (P) or distinct from these, which comprises an opening (4), in particular wherein said third member is a unitary part; and - an optical element (30,32). The first member (O) comprises a transparent portion (t) through which light can pass, and said optical element (30,32) is attached to said first face or is comprised in said first member (O) at said first face. And said optical element (30,32) is spaced apart from said transparent portion (t) and located within said opening. Various optical arrangements can be realized this way in a miniscule optical package (1).