公开(公告)号：US20170342196A1

公开(公告)日：2017-11-30

申请号：US15533310

申请日：2015-12-16

Applicant: Hexcel Holding GMBH

Inventor： Bernhard Neumayer

IPC: C08G59/40 ,  B29B11/16 ,  B32B5/02 ,  B32B15/092 ,  B32B15/20 ,  C08G59/68 ,  C08K3/36 ,  C08J5/24 ,  C08J5/04 ,  C08L63/00 ,  C08G59/24 ,  A63C5/12 ,  B29K63/00

CPC classification number: C08G59/4021 ,  A63C5/12 ,  B29B11/16 ,  B29K2063/00 ,  B32B5/022 ,  B32B15/092 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  C08G59/245 ,  C08G59/686 ,  C08J5/043 ,  C08J5/10 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2463/10 ,  C08K3/36 ,  C08L63/00 ,  C08L2205/06

Abstract: This invention relates to a composition comprising a semisolid epoxy resin containing a curative dispersed therein. The curative has a particle size such that at least 90% of the particles have a size below 25 pm at ambient temperature of 21° C., wherein the composition further comprises a diluent containing a particulate filler. The composition is used as matrix in prepregs. The use of the diluent increases peel strength of the composition when brought into contact with metal or wood substrate.

公开(公告)号：US10246549B2

公开(公告)日：2019-04-02

申请号：US15533310

申请日：2015-12-16

Applicant: Hexcel Holding GMBH

Inventor： Bernhard Neumayer

IPC: C08J5/10 ,  C08G59/40 ,  B32B5/02 ,  A63C5/12 ,  C08J5/04 ,  C08J5/24 ,  C08K3/36 ,  B29B11/16 ,  B29K63/00 ,  B32B15/20 ,  C08G59/24 ,  C08G59/68 ,  C08L63/00 ,  B32B15/092

Abstract: This invention relates to a composition comprising a semisolid epoxy resin containing a curative dispersed therein. The curative has a particle size such that at least 90% of the particles have a size below 25 pm at ambient temperature of 21° C., wherein the composition further comprises a diluent containing a particulate filler. The composition is used as matrix in prepregs. The use of the diluent increases peel strength of the composition when brought into contact with metal or wood substrate.