公开(公告)号：US20190077905A1

公开(公告)日：2019-03-14

申请号：US16126612

申请日：2018-09-10

Applicant: Hexion Inc.

Inventor： Amitabh BANSAL ,  Larry Steven CORLEY ,  Diana SEPULVEDA-CAMARENA ,  Jennifer W. CHUNG ,  Leeanne TAYLOR ,  Alla HALE

IPC: C08G59/36 ,  C08G59/32 ,  C08G59/56

Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.