公开(公告)号：US09790313B2

公开(公告)日：2017-10-17

申请号：US14831586

申请日：2015-08-20

Applicant: Hexion Inc.

Inventor： Ganapathy S. Viswanathan ,  Craig M. Zirkle

IPC: C08G12/32 ,  C08G12/12 ,  C08L61/24 ,  C08L61/28

CPC classification number: C08G12/32 ,  C08G12/12 ,  C08L61/24 ,  C08L61/28 ,  C08L61/06 ,  C08L63/00

Abstract: Disclosed are curing compositions for resin systems and in particular for phenolic resin systems and epoxy resin systems, to methods of preparing the curing compositions and to resin systems incorporating same. The curing compositions of the invention are the reaction product of an aldehyde with an amine in the presence of an aprotic solvent.