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公开(公告)号：US12275816B2
公开(公告)日：2025-04-15
申请号：US17731580
申请日：2022-04-28
Applicant: Hexion Inc.
Inventor： Matthew Sumpter
IPC: C08G59/24 , C08F220/28 , C08G59/50 , C09D163/00
Abstract: Embodiments of the present disclosure generally relate to epoxy resin compositions and coating systems used to form epoxy resin compositions. In an embodiment, an epoxy resin composition is provided. The resin composition includes an epoxy resin; a curing agent; and an acetoacetoxy-functionalized polymer.
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