公开(公告)号：US20250092247A1

公开(公告)日：2025-03-20

申请号：US18882016

申请日：2024-09-11

Applicant: Hexion Inc.

Inventor： Lem GABREHIWET ,  Shuna CHENG ,  Gregory D. BRINER ,  Jason L. HOLDER

IPC: C08L61/12 ,  C08K5/053 ,  C08L91/06 ,  D21H17/06 ,  D21H17/48 ,  D21H17/60 ,  D21J1/08

Abstract: Embodiments of the present disclosure generally relate to phenolic resin compositions, methods for preparing the same, and uses thereof. In an embodiment, a resin composition is provided. The resin composition includes a wax emulsion and a polymer composition that includes an alkylphenol-phenol-aldehyde polymer, the alkylphenol-phenol-aldehyde polymer including: alkylphenol monomer units; and phenol compound co-monomer units. In another embodiment is provided an article of manufacture that includes a lignocellulosic substrate, and a resin composition that includes an alkylphenol-phenol-aldehyde polymer, a polyhydric alcohol, and a wax emulsion.