公开(公告)号：DE3280236D1

公开(公告)日：1990-10-04

申请号：DE3280236

申请日：1982-12-10

Applicant: IBM

Inventor： ACITELLI MARIO ADAM ,  TYNAN RICHARD FRANCIS ,  WAYSON ALAN ROBERT

IPC: B41M3/06 ,  B41M3/14 ,  B44F1/12 ,  C09D11/00 ,  C09D11/02 ,  G06K7/12 ,  B41J2/005 ,  C09B19/00

公开(公告)号：IT1165394B

公开(公告)日：1987-04-22

申请号：IT2781179

申请日：1979-12-04

Applicant: IBM

Inventor： ACITELLI MARIO ADAM ,  WOODS JAMES JOHN

IPC: B32B15/04 ,  B29C63/00 ,  B32B7/12 ,  B32B15/08 ,  B32B37/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/31 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K

Abstract: A process for preparing an epoxy impregnated laminate having an adhesive surface conductive to electroless plating wherein the adhesive surface is applied from a transfer sheet as a substantially uncured phenolic thermosetting resin/nitrile rubber polymer adhesive layer which is thereafter cured by subjecting the laminate to heat and pressure curing conditions.